Lead free tin Solder paste type 7 silver solder paste SAC305

Type 7 silver solder paste SAC305
Solder paste is a form of solder that is used in PCB assembly, and including prototype PCB assembly, especially when using reflow soldering techniques. The solder paste is a mixture a solder spheres and a specialized form of flux. This means that the solder forms a form of paste that can be printed onto the surface of the printed circuit card in the required.

type 7(2~12micron) solder paste SAC305 that is Sn96.5Ag3.0Cu0.5 is a no-clean formula. The residues do not need to be removed for typical applications. AlthoughSAC305 is designed for no-clean applications, its residues can be easily removed using automated cleaning equipment (in-line or batch) with a variety of readily available cleaning agents.
Clients Zone:
For now,our type 7 SACX305 solder paste expored to Israel,Canada,Germany,France,Mid-Eastern Asia countries,and part of Eastern European contries.
we are appreciated your kindly inquiry and cooperations with you,if you are interested in our items.
type seven Sn96.5Ag3.0Cu0.5 no clean solder paste does require refrigeration if left at room temperature 3-10 degree for 6 months shelf life.
type 7 Sn96.5Ag3.0Cu0.5 Solder paste basics
The solder particles are a mixture of solder. Traditionally this used to be tin and lead, but with the legislation being introduced around the world, there is a move to lead free solders. These may be made from a variety of mixtures. One is 96.5% tin and 3.0%silver and 0.5% copper, which has exllent soldering result performent.
supply type 7 Sn96.5Ag3.0Cu0.5 silver solder paste has following feature:
1)Can print down to 8 mil x 8 mil apertures
2) Designed specifically for fine feature printing with T7 powder
3)Low QFN/BGA voiding
4) Excellent solderability with halogen-free chemistry
5)Optimized flux residues to mitigate head-in-pillow defects
6)Capable of print speeds up to 6 in/sec (150mm/sec)
7)Low slump behavior minimizes defects
supply type 7 silver solder paste,just as the following specification,our solder paste are highly appreciated by clients arround the world.
Test Content–
Test Item Test Result Test Method
Copper Plate Corrosion Test Pass JIS-Z-3197, 8.4.1
Spread Test > 75% JIS-Z-3197, 8.3.1.1
Copper Mirror Test Pass IPC-TM-650, 2.3.32
Viscosity Test(25 °C,10rpm) 220 ± 30 Pa • s JIS-Z-3284. Annex 6
Tackiness Test (gf) > 130 (8hr) JIS-Z-3284. Annex 9
Slump Test Pass JIS-Z-3284. Annex 7, 8
Solder Ball Test Pass JIS-Z-3284. Annex 11
–Reliability Test–
S.I.R. Test ◊ > 1×109 Ω , Pass IPC-TM-650, 2.6.3.3
Electro Migration Test ♦ Pass IPC-TM-650, 2.6.14.1
◊ Test Conditions: 85 °C, 85% RH for 168 hrs ♦Test Conditions: 65 °C, 85% RH for 596 hrs
–Alloy Composition–
(Sn) (Ag) (Cu) (Ni) (Ge) (Zn) (Al) (Sb) (Fe) (As) (Bi) (Cd) (Pb)
REM. 2.8~3.2 0.3~0.7 0~0.01 0~0.01 0.001 MAX 0.001 MAX 0.05 MAX 0.02 MAX 0.03 MAX 0.10 MAX 0.002 MAX 0.05 M

Type 7 SAC305 solder paste REFLOW TIME PROFILE
Heating rate the time required to 120 ºC constant tem.
130 – 170ºC peak tem. > 220°C cooling rate
1-3 ºC/sec < 60—90secs 60—120secs < 245 ±5ºC < 40—80secs <4ºC / S
Storage, Handling, and Shelf Life:
Refrigeration is the recommended optimum storage condition fortype7 SAC305 lead free solder pasteto maintain consistent viscosity,reflow characteristics and overall performance. SAC305 lead free solder pasteshould be stabilized at room temperature prior to printing. SAC305 lead free solder pasteshould be kept at standard refrigeration conditions, 0-10°C (32-50°F). Please contact us if you require additional advice with regard storage and handling of this material. Shelf life is 6-10 months from date of manufacture when handled properly and held at 0-10°C (32-50°F).
Small knowledge of type 7 Sn96.5Ag3.0Cu0.5 silver lead free solder paste
How to use solder paste
When solder paste is used in mass PCB assembly as well as prototype PCB assembly there are a number of stages that are undertaken. First solder paste is applied to the printed circuit boards. The solder paste is only applied to the areas where solder is required. This is achieved using a solder paste stencil that only allows the solder paste through in certain areas. (Further information is available on another page in this section of the website).

Once the solder paste has been applied to the printed circuit board, it is then passed into the pick and place machine where the components are added. The solder paste has sufficient tension that it holds the components in place. However care should be taken not to knock the board at this stage otherwise the components may move of fall off. Additionally the board should be soldered within a few hours of being placed, otherwise the solder paste may deteriorate.
Any further information,please feel free to consult  technician team.
Application of type7 SAC305 solder paste:
1)can supply jar packing of 500g used for stenciling solder technique,SMD,SMT technology.
2) can supply syring tube packing of 100g,which is used for dispensing technique,for some high quality electronics.
type7 solder paste packing Details:
Packing could be classified as can/bottle packing and syringe packing type.
Each can/bottle holds the solder cream is 500g;
Each syringe can load the solder cream is 100g
The packing materials can be separated into inner layer of a bubble box and outer package of a paper carton so as to better secure for shipping and transportation.
Specification Sn96.5Ag3.0Cu0.5 type7
Appearance gray tacky paste
Weight 500g/jar or 100g/syringe;10kg/carton
we are solder wire,solder paste,solder power,solder bar, flux, red glue,and so on , please feel free contact us .