Solder is a fusible alloy used to join less fusible metals or wires, etc. Solder is sold in spools of wire or in bars. Solder wire is comprised of different alloys, or of pure tin. Each metal requires a certain type of soldering wire to create strong bonds, because the combinations of metals that comprise soldering wire melt at different temperatures.
Soft soldering wire that contains lead is comprised of combinations of tin, lead, silver, cadmium and copper. Combinations of tin and lead are most common, in ratios of 60 percent tin/40 percent lead; 63 percent tin/37 percent lead; and 50 percent tin/50 percent lead. These solders melt in a range from 361 to 421 degrees with the higher the percentage of lead, the higher the melting point.
Lead-free soldering wire is comprised of various combinations of tin, copper, silver and antimony. Pure tin wire has the highest melting point of 449 degrees. Other combinations of metals melt in a range between 419 and 441 degrees.
Uses
Lead-free soldering wires include varieties with “no clean” flux that are used in electronics. No clean flux does not leave a residue of foreign particles after fusing. Stainless steel requires an acid core soldering wire. Rosin core wire creates bonds with extra strength.
Cost
Leaded solder wire is less expensive than lead-free solder wire. Prices vary according to the metallic content of each alloy, and the size of the spool.
We can offer all kind of solder wire base on your need . Welcome to send enquiry to us .
Attachment of temperature-sensitive components to printed circuit boards
Step soldering, when a secondary, lower temperature reflow process is required after a standard SAC soldering process is completed
Eliminating warpage of thinner chips due to high-temperature reflow
Low melting or low-Tg flex circuitry which are used in cellphones, smartwatches, and many internet-of-things (IoT) devices
Large area array devices – such as BGAs – to avoid head-in-pillow (HIP) and non-wet-open (NWO) failures
Durafuse LT
Indium Corp has invented a new low-temperature solder paste called Durafuse LT. This new alloy reflows at 200°C and uses a novel solder alloy process to bring mid-temperature solder properties into the upper edge of the low-temperature space. This provides greater drop shock and thermal cycling performance as compared to the typical BiSnAg alloys currently on the market.
Older legacy low-temp options are brittle and tend to crack when stressed, which make them unsuitable for many applications. Durafuse LT is more robust and increases durability in drop shock, not just incrementally, but by a significant measure. In fact, under the right process conditions, Durafuse LT’s performance is comparable to SAC305.
Other low-temperature alloys include:
Indalloy #
Liquidus (°C)
Solidus (°C)
Element 1
%
Element 2
%
Element 3
%
Element 4
%
1E
118
118
In
52.0
Sn
48.0
1
125
118
In
50.0
Sn
50.0
71
131
118
Sn
52.0
In
48.0
281
138
138
Bi
58.0
Sn
42.0
282
140
139
Bi
57.0
Sn
42.0
Ag
1.0
290
143
143
In
97.0
Ag
3.0
87
145
118
Sn
58.0
In
42.0
203
150
125
In
95.0
Bi
5.0
88
150
150
In
99.3
Ga
0.7
225
151
143
In
90.0
Sn
10.0
90
152
152
In
99.4
Ga
0.6
91
153
153
In
99.6
Ga
0.4
2
154
149
In
80.0
Pb
15.0
Ag
5.0
92
154
154
In
99.5
Ga
0.5
4
157
157
In
100.0
204
175
165
In
70.0
Pb
30.0
205
181
173
In
60.0
Pb
40.0
231
186
174
Sn
86.5
Zn
5.5
In
4.5
Bi
3.5
227
187
175
Sn
77.2
In
20.0
Ag
2.8
226
187
181
Sn
83.6
In
8.8
Zn
7.6
Low-Temperature Solder Applications
In addition to soldering, Indium Corp provides low-temperature solutions for thermal management, hermetic sealing, fusible alloys, eye glass lens blocking, and more.
Thermal Management
Alloy systems that are liquid at room temperature have a high degree of thermal conductivity, far superior than ordinary non-metallic liquids. This allows for the use of these materials in specific heat-conducting applications, such as heat dissipation in sensitive components during operation, machining, and/or manufacturing.
Other advantages of these liquid alloy systems are their inherent electrical conductivity. Typical applications for these materials include thermostats, switches, barometers, heat transfer systems, and thermal cooling and heating designs.
Hermetic Sealing
Some sealing operations use pure indium and require no heat at all. The sealing process uses mechanical pressure to create the bond. The softness and malleability of indium, in addition to its ability to retain these characteristics at cryogenic temperatures, allows it to fill in imperfections in mating surfaces to create a hermetic seal.
Fusible Alloys
Low-temperature or fusible alloys are commonly used in a variety of safety devices where they are designed to melt at a peak temperature to initiate a process. Eye glass lens blocking is another application where low-temperature or fusible alloys work well. The lens is held in place using a block of the alloy, which is then easily removed with hot water.
Some common fusible alloys are:
Indalloy
Property
117
158
160-190
217-440
255
281
Property
Indalloy 117
Indalloy 158
Indalloy 160-190
Indalloy 217-440
Indalloy 255
Indalloy 281
Melting Point or Range Deg/F
117
158
160-190
217-440
255
281
Weight lbs/in3
.32
.339
.341
.343
.380
.315
Tensile Strength lbs/in2
5,400
5,990
5,400
13,000
6,400
8,000
Brinell Hardness No.
12
9.2
9
19
10.2
22
Maximum Load 30 sec lbs/in2
—
10,000
9,000
16,000
8,000
15,000
Safe Load Sustained
—
300
300
300
300
500
Conductivity (Electrical) Compared with Pure Copper
3.34%
4.17%
4.27%
2.57%
1.75%
5.00%
We offer all kind of solder product , Pls feel free contact us.
Tin-Bismuth-silver(Sn64Bi35Ag1) solder wire, with a melting point of 179 degrees C, is ideal for soldering of temperature sensitive components. Supplied as a solid core (no inner flux core) lead free solder wire, this solder gives good wetting and solder flow. Packaged as a 1000g box this solder wire we recommend using with the PF670 flux gel to promote increased rapid wetting.
Low temperature eutectic Tin Bismuth alloy Prevents thermal damage to heat sensitive devices Low to non-toxic lead free solder Available currently in a 0.5mm,0.6mm,0.8mm,1.2mm and 2.0mm diameter.
Packing：1kg/case
Feature of Sn64Bi35Ag1 no flux core Bismuth solder wire
The most popular lead-free bismuth solder alloys are BBI-W104 (58Bi 42Sn) which melts at 138°C and BBI-W105 (Sn64-Bi35Ag1) which melts at 179°C. The addition of the 1% Ag makes the alloy more malleable. Both alloys can be used for step soldering applications. After the initial joints are made with a standard SAC alloy (220°C) subsequent soldering operations can be done using the bismuth alloys.
Sn64Bi35Ag Bi solder wire has joint properties similar to those of tin-lead solders, with superior fatigue and copper dissolution characteristics.
Bismuth is the most diamagnetic and the least thermally conductive of all metals
In addition to being non-toxic it does not oxidize as readily as lead does.
Feature of other solder wire is also available for Low temperature eutectic Tin Bismuth silver alloy:
Excellent scalability
High quality soldering wire on the market
Refined welding good fluidity, wetting, smoke spatter
Excellent First Pass Solder Joints. JIS Spread ≥ 80%.
Quick acting flue dissolves surface oxides for good wetting
Good solderability, insulation resistance, No spattering and Non-corrosive.
Widely used in electrical and electronics, solder parts like circuit board, electronics devices and others.
More than 10 years specialized in metal industry, accumulated a lot of talent and technology, created international marketing network, for now, have cooperated with many of oversea enterprises of over 80 countries around the world.e.g.America,Israel,India,Germany,Russia,Poland,LTU,Switzerland,Korea,Romannia,Bulgaria,Colombia,France etc. Specification of Sn/Bi/Ag low temperature solder wire:
Item： Low temperature solder wire
Specification: BBI-W105(Sn64Bi35Ag1) 1. Purity and chemistry component
Specification
Sn64Bi35Ag1- no flux core solder wire
Appearance
Lucent,no dirt on surface
Weight
Net: 500g/case;1000g/case
Chemistry component
Elements Specification(%) Tested result(%WT)
Sn 63.0~65.0 64.0
Ag 0.8~1.2 1.0
Al 0.005 0.0003
As 0.030 0.0060
Sb 0.050 0.0148
Bi Remainder Remainder
Cu 0.080 0.0003
Fe 0.010 0.0003
In 0.050 0.0019
Ni 0.010 0.0007
Pb 0.050 0.0257
Cd 0.002 0.0002
Au 0.050 0.0010
Ag 0.050 0.0002
a. The above concentration of specification are in % weight.
b. Single value listed are the maximum allowable standard.Flux content(%): 0
Diameter of wire: 0.5mm,0.6mm,0.8mm,1.0mm,1.2mm and 2.0mm
Physical feature of Sn64Bi35Ag1 solid solder wire
Alloy component
Melting
point℃
Working temperature℃
Gravity g/cm3
Rigidity HB
Conduct heat
M.S.K
Extend
Mpa
Extend
rate
%
Conductivity %
Sn64Bi35Ag1
179
100~210
8.5~8.7
11~12
68
45
70-100
18.0
The more informations about Sn64Bi35Ag1 middle temperature metiong lead free solder wire,please feel freely contact with us.
Sn64Bi35Ag1 and other tin bismuth wire Application:
Advantages of Bismuth-based Alloys for Low Temperature Pb-free Soldering and Rework.
More and more requirment for middle and low temperature solder wire for moblie electronics,smart-home electronics..
The increased function of personal electronic devices, such as mobile phones and personal music devices, has driven the need for smaller and smaller active and passive components. This trend toward miniaturization, occurring at the same time as the conversion to RoHS-compliant lead-free assembly, has been a considerable challenge to the electronics assembly industry. The main reason for this is the higher reflow process temperatures required for Pb-free assembly. These higher temperatures can thermally damage the PCB and the components. In addition, the higher reflow temperatures can negatively affect the solder joint quality, especially when coupled with the smaller paste deposits required for these smaller components. If additional thermal processing is required, the risk increases even more.
Packing of tin-bismuth-silver solder wire
Product Type
Solder wire Sn64Bi35Ag
Material
Tin-Bismuth-Silver alloy
Composition
tin64%,bismuth 35%,silver 1%
Melt point
179degree
Flux content
no flux
Application
Metal soldering,electronics
Density (g/m^3)
8.3
Diameter
0.5mm，0.7mm,0.8mm,1.0mm,1.2mm,2.0mm
Packing
500g/case,1kg/case
Type
no flux core solder wire
Place of origin
Shenzhen,Dongguan city
Keyword
Tin bismuth silver lead free no flux core solder wire
Solder Factory from China 