Guangdong welding Fluxes Solder paste manufacturer solder paste jar for screen printer Sn63Pb37 soldering paste 50g 100g 500g per jar
Description of solder paste jar
Sn63Pb37 no clean solder paste was developed to meet the demands of tin lead soldering when lead free components are present in the circuit assembly. Like all solder pastes, SN63PB37 solder cream has excellent print volume repeatability to minimize variation in the print process. SN63PB37 minimizes print cyle times through high print speeds and extended number of prints between stencil under cleaning.
Powder size:
| MESH SIZE | MICRONS SIZE | Particular type |
| -200+325 | 75-45μm | 2 |
| -325+500 | 45-25μm | 3 |
| -400+635 | 38-20μm | 4 |
| -500 | 25-15μm | 5 |
| -635 | 15-3μm | 6/7 |
Clients Zone:
For now,our Sn63Pb37 solder paste expored to Russia,Brazil,Kenya,Egypt,Iraq. ,Asia countries,and part of Eastern European contries.we are appreciated your kindly inquiry and cooperations with you,if you are interested in our items.SN63PB37 is also a zero halogen product with very low halogens intentionally added to the formulation. also can supply 100g per syringe packing solder paste,which need to use reflowing machines for spot welding technique.
Feature of solder paste jar
2.It is an organic acid, water-soluble solder paste that provides users with the highest level of consistency and performance.
3.Batch after batch, HM531 provides hours of stable stencil life, tack time and repeatable brick definition.
Availability:
3.Tin lead solder paste commonly available in the Sn63Pb37 and Sn62Pb36Ag02 alloys. Type 3 powder mesh is recommended, but different powder particle size distributions are available for standard and fine pitch applications. For specific packaging information see Solder Paste Packaging Chart for available sizes. The appropriate combination depends on process variables and the specific application.
Printing Parameters:
Squeegee Blade
Squeegee Speed
Stencil Material
Temperature/Humidity
80 to 90 durometer polyurethane or stainless steel
Capable to a maximum speed of 150 mm/sec (6 in/sec)
Stainless Steel, Molybdenum, Nickel Plated, Brass
Optimal ranges are 21-25°C (70-77°F) and 30-70% RH
Storage, Handling, and Shelf Life
Refrigeration is the recommended optimum storage condition for solderpaste to maintain consistent viscosity,
reflow characteristics and overall performance. HM531 should be stabilized at room temperature prior to
printing. It should be kept at standard refrigeration conditions, 0-10°C (32-50°F). Please contact us if you require additional advice with regard storage and handling of this material. Shelf life is 6 months
from date of manufacture when handled properly and held at 0-10°C (32-50°F).
Health & Safety
This product, during handling or use, may be hazardous to health or the environment. Read the Material Safety Data Sheet and warning label before using this product.
Packing Details
Each can/bottle holds the solder cream is 500g;
Each syringe can load the solder cream is 100g
The packing materials can be separated into inner layer of a bubble box and outer package of a paper carton so as to better secure for shipping and transportation.
| Specification | Sn63Pb37 |
| Appearance | gray tacky paste |
| Weight | 500g/jar or 100g/syringe;10kg/carton |
Solder Factory from China 