Solder mounting materials

2001年9月20日2016年10月4日 ChinaFactory一条评论

NOF and solder mounting materials
Many alloys are under consideration as replacements for lead-based solder.working on tin-alloys, which have a melting point near that of lead-based solder and provide the opportunity to use NOF’s expertise in blocked carboxylic acid technology. Research is focusing on ways to solve the problem of metal deterioration caused by a chemical reaction with the carboxylic acid contained in the flux.

NOF and solder mounting materials

Solder particle

What is solder?
Solder is an age-old technique used to connect two types of metals. In the electronics industry, solder is used to attach electronic components to copper circuit lines on printed circuit boards.

What is solder paste?

What is solder

All about flux

Flux is a compound that includes carboxylic acid, often from rosin made from pine sap. Flux performs the following functions that are essential to linking two surfaces using solder.

All about flux

Rosin

Using rosin or other chemical compounds containing carboxylic acid, flux plays a vital role in soldering as shown below.

Surface tension of solder coated by molten flux

Functions of flux
(1) Removes the oxide film from metal surfaces 2RCOOH + Cu2O -> 2RCOOCu + H2O
(2) Prevents oxidation by coating the solder
(3) Lowers surface tension

What is solder paste?
Solder paste is made by mixing a fine solder powder with liquid flux to produce a compound with a paste-like consistency. This paste is printed on the copper circuit pattern where components are to be mounted. Once components are in place, the board is heated to melt the metal in the solder and hold the components to the board.

Improvements in solder composition
An alloy of tin and lead was commonly used for many years but is no longer acceptable due to environmental issues. Companies are being required to switch to solder alloys that do not incorporate lead.

How lead-based solder damages the environment

Harmfull things

Due to problems associated with reliability of the metal following
attachment, and to other issues, interest is currently focused on tin-silver compounds that have a melting point about 40^°C to 50^°C higher than lead-based solder. As a result, improvements are needed to make components that are resistant to higher temperatures and to enhance the performance of soldering ovens.

In addition, some companies have started studying tin-zinc compounds because they can be used with existing soldering ovens.

Due to problems associated with reliability of the metal following

Melting points of solder alloys

lead free bar solder Eco rohs SAC305 soldering bar

2001年9月5日2019年6月13日 ChinaFactory留下评论

lead free bar solder Eco rohs SAC305 soldering bar

lead free bar solder Sn96.5Ag3.0Cu0.5

Sn96.5Ag3Cu0.5 lead free solder bar is lead-free alloys suitable for use as a replacement for Sn63 alloy. The SAC3053 tin bar variants is used to stabilize / reduce the copper content in the wave solder bar, this requirement will depend on process conditions. As with all our Metals bar solder, proprietary alloying process is used to remove certain impurities, particularly oxides.

SPEED – 0.75 seconds typical wetting speed compares to SAC305 at 0.65 sec and superior to Sn99.3/Cu0.7 based
alloys at 1.0 sec.
DROSS GENERATION – lowest in class due to the process in conjunction with the addition of a dross reducing agent.

Feature:
High Purity

Excellent solderability
Good wetting
Low oxides, low drossing
Solder bar, chunks, anodes, preforms and solid wire
VACULOY alloy conditioning process

Advantage:
Lowers Total Cost of Ownership due to the lower material cost, high yields and low dross generation.
Gives very good solderability due to the fast wetting speed.
Gives very good drainage and hence lower levels of bridges due to the formulation containing Silver.
Delivers good performance across a range of flux technologies.

SACX305 solder bar is suitable for wave soldering and surface mount applications for electronic assemblers interested in implementing a lead-free process. It is suited to single side and mixed technology boards. A solder pot temperature
of 255 – 265° C (491 – 509F) is recommended with a contact time 2.3 – 3.5 seconds. For suitable wave solder fluxes, please
see our selector guide. Lead free Reclaim services including dedicated lead free containers are also available, please consult our local sales office.

Specification	Sn99-Ag3.0-Cu0.5 bar solders
Appearance	Lucent, no dirt on surface
Size	Length×wideness×Thinckness×Weight(L×W×T×W):32cm×1.8cm×1.5cm×0.7kg/pc 20kg/carton

Supply ability:
We are specialized in kinds of soldering products
Solder wire:80-150Metric ton per month
Solder bar:Above100 ton per month
Solder paste:10-50 ton per month
Other solder:can meet customer’s demand
Certificate:
Newest SGS test;ISO9001:2008;RoHS,REACH etc
Shipping way:
We have a cooperation with big express company,such as CHINA POST(EMS),TNT,DHL,FEDEX,UPS;
We also connect with SF express inland market,while the delivery time is short.During shipping,we will follow up within 24 hours,and report the relevant process scheduling for you.

Unclassified

Sn63Pb37 type 3 solder paste manufacturer in China

2001年4月26日2019年6月13日 ChinaFactory留下评论

Guangdong welding Fluxes Solder paste manufacturer solder paste jar for screen printer Sn63Pb37 soldering paste 50g 100g 500g per jar

Description of solder paste jar

Sn63Pb37 no clean solder paste was developed to meet the demands of tin lead soldering when lead free components are present in the circuit assembly. Like all solder pastes, SN63PB37 solder cream has excellent print volume repeatability to minimize variation in the print process. SN63PB37 minimizes print cyle times through high print speeds and extended number of prints between stencil under cleaning.

https://www.youtube.com/watch?v=b_tNWaIceys&feature=youtu.be
Powder size:

MESH SIZE	MICRONS SIZE	Particular type
-200+325	75-45μm	2
-325+500	45-25μm	3
-400+635	38-20μm	4
-500	25-15μm	5
-635	15-3μm	6/7

Clients Zone:

For now,our Sn63Pb37 solder paste expored to Russia,Brazil,Kenya,Egypt,Iraq. ,Asia countries,and part of Eastern European contries.we are appreciated your kindly inquiry and cooperations with you,if you are interested in our items.SN63PB37 is also a zero halogen product with very low halogens intentionally added to the formulation. also can supply 100g per syringe packing solder paste,which need to use reflowing machines for spot welding technique.

Feature of solder paste jar

1.Sn63Pb37 solder paste, due to 36%tin mixed with 37%lead,that cause a very prefer soldering for kinds of electronics component.

2.It is an organic acid, water-soluble solder paste that provides users with the highest level of consistency and performance.

3.Batch after batch, HM531 provides hours of stable stencil life, tack time and repeatable brick definition.

Availability:

3.Tin lead solder paste commonly available in the Sn63Pb37 and Sn62Pb36Ag02 alloys. Type 3 powder mesh is recommended, but different powder particle size distributions are available for standard and fine pitch applications. For specific packaging information see Solder Paste Packaging Chart for available sizes. The appropriate combination depends on process variables and the specific application.

Printing Parameters:

Squeegee Blade

Squeegee Speed

Stencil Material

Temperature/Humidity

80 to 90 durometer polyurethane or stainless steel

Capable to a maximum speed of 150 mm/sec (6 in/sec)

Stainless Steel, Molybdenum, Nickel Plated, Brass

Optimal ranges are 21-25°C (70-77°F) and 30-70% RH

Storage, Handling, and Shelf Life

Refrigeration is the recommended optimum storage condition for solderpaste to maintain consistent viscosity,

reflow characteristics and overall performance. HM531 should be stabilized at room temperature prior to

printing. It should be kept at standard refrigeration conditions, 0-10°C (32-50°F). Please contact us if you require additional advice with regard storage and handling of this material. Shelf life is 6 months

from date of manufacture when handled properly and held at 0-10°C (32-50°F).

Health & Safety

This product, during handling or use, may be hazardous to health or the environment. Read the Material Safety Data Sheet and warning label before using this product.

Packing Details

solder paste could be classified as can/bottle packing and syringe packing type.
Each can/bottle holds the solder cream is 500g;
Each syringe can load the solder cream is 100g
The packing materials can be separated into inner layer of a bubble box and outer package of a paper carton so as to better secure for shipping and transportation.

Specification	Sn63Pb37
Appearance	gray tacky paste
Weight	500g/jar or 100g/syringe;10kg/carton

Industrial News · SOLDER PASTE · Unclassified

Indium8.9HF Solder Paste Technology Solution to Avoid the Void

2001年4月12日2019年6月13日 ChinaFactory留下评论

Indium Indium8.9HF is a halogen-free, no-clean solder paste that is specifically formulated to Avoid the Void™, while delivering high transfer efficiency with low variability.
In addition to outstanding print transfer and response-to-pause, this no-clean solder paste also provides excellent pin-in-paste solderability and hole-fill, while remaining stable at room temperature for up to 30 days.
Indium8.9HF is perfectly suited for a variety of applications, especially automotive, due to its unique oxidation barrier technology. This solder paste delivers robust reflow capability and a wide process window, accommodating various board sizes and throughput requirements, minimizing potential defects.
Indium8.9HF solder paste is part of our family of high-performance, lead-free, low-voiding, no-clean solder pastes that help manufacturers to Avoid the Void. For more information about Indium8.9HF, email us or visit solder1.wordpress.com.
We are a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, thermal management, and solar markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, Indium has global technical support and factories located in China,India Malaysia, Singapore,Japan,Germany, the United Kingdom, and the USA.

Eco solder(Rohs) · SOLDER BAR · Unclassified

SACX0307 wave soldering stick tin bar

2000年9月28日2019年6月13日 ChinaFactory留下评论

SAC0307 wave soldering stick tinbar

SAC305 solder bar

SACX0307 wave soldering stick/bar

Item bar solders			Sn99-Ag0.3-Cu0.7 bar solder
Appearance			Lucent, no dirt on surface of stick appearance
Size			(L×W×T×W):32cm×1.8cm×1.5cm×0.7kg/pc 20kg/carton
Chemistry component
Sn	Ag	Cu	Pb	Sb	Bi	Zn	Fe	Al	As	Cd
99	0.3+/-0.1	0.7±0.2	<0.01	<0.02	<0.01	<0.02	<0.02	<0.02	<0.03	<0.002

SACX0307 is a patented (US Patent No 4,929,423) lead-free alloy suitable for use as a replacement for Sn63 alloy in the wave solder process.

SAC0307 soldering bar used to stabilize / reduce the copper content in the wave solder bar, this requirement will depend on process conditions. As with all Metals bar solder,B proprietary alloying process is used to remove certain impurities, particularly oxides.

PCB soldering

Lead-Free Compound

Lead-free soldering barcomprised of various combinations of tin, copper, silver and antimony. Pure tin wire has the highest melting point of 449 degrees. Other combinations of metals melt in a range between 419 and 441 degrees.It is used for wave soldering technique and handling solder.

SAC plus0307 solder stick/bar description:
SACX plus0307 is a patented (US Patent No 4,929,423) lead-free alloy suitable for use as a replacement for Sn63 alloy in the wave solder process. The SACX plus0307 variant is used to stabilize / reduce the copper content in the wave solder bath, this requirement will depend on process conditions. As with all our Metals bar solder, our technician alloying process is used to remove certain impurities, particularly oxides. The product is further enhanced with the addition of 2 minor elements to reduce dross formation and improve the joint cosmetics.
SACX Plus^® 0307 also delivers the same high yield wave soldering and reliability performance as the original. As with all SACX alloys, minimal solder dross is also produced due to our proprietary Vaculoy^® manufacturing process and the addition of just the right amount of proprietary additives.

Lead freesolder item:

No clean lead-free solder wire	melting point °C	Tensile strength	elongation reat%	expansion rate%	Diameter	Application	Solder wire alloy	Solder bar alloy	Solder paste alloy	Solder powder alloy
Sn99.3Cu0.7	227	30	45	70	≥0.1mm	low cost, the most commonly used; Lead-free solder for general welding	yes	yes	yes	yes
Sn96.5Ag3.0Cu0.5	217	40	58	78	≥0.1mm	high cost, relatively bright spot; high performenceCan be excellent for demanding welding	yes	yes	yes	yes
Sn99.95
Sn99.0Ag0.3Cu0.7
Sn42Bi58	138	38	50	75	≥0.5mm	High cost	yes	yes	yes	yes

Tin-lead alloy bar solders

SACX pluso3o7 solder bar is suitable for wave soldering and surface mount applications for electronic assemblers interested in implementing a lead-free process. It is suited to single side and mixed technology boards.Soldering bar(tin solder bar ) is applicable to various high temperature soldering, especially siver solder bar good in inductance wires, transformer and other industries. The alloy composition can be changed according to specific requirement.Apply forComputers, precision instruments, meters, TV, micro technology, coating metals.SACX plus0307 stick is optimized for use in wave and rework operations. Special additives minimize copper erosion during long, hot rework cycles.

Alloy composition Sn/Pb	Specific gravity	Liquid temperature	Temperature	Application
63/37	8.39	183	220~240	Computers, precision instruments, meters, TV, micro technology, coating metals
60/40	8.65	190	230~250
55/45	8.75	200	240~260	Calculators, tape recorders, telephones, quartz and other common electronic and electrical products
50/50	8.85	216	255~275
45/55	8.97	227	270~290
40/60	9.30	238	295~310	General circuit boards, toys, lamps, crafts, water tanks, plumbing solder

Solder products · Unclassified

Solder Balls or Solder Balling on a PCB

2000年9月12日2016年10月4日 ChinaFactory留下评论

25K pcs per bottle

Precision BGA Spheres Optimize Sphere Performancemanufactures solder spheres for PBGA, CBGA, TBGA, µBGA, and flip-chip applications. The solder spheres are made using a proprietary manufacturing process that provides consistently high sphericity and accurate diameters.

Indium Corporation can make almost any solder alloy sphere to suit customer needs. Standard alloys include both Pb-free and SnPb eutectic. Standard sphere diameters are commonly packaged in tape & reel and are listed below. We are constantly expanding and adapting our product offering to meet customer needs, so please contact us if you have a unique request.

inches
mm
0.024
0.610
0.035
0.889
0.062
1.57
Packaging:
We also offer two different standard diameter reels for tape & reel solder spheres

Sphere
Diameter (in) Maximum Spheres
Per 7″ Reel (K) Maximum Spheres
Per 13″ Reel Carrier Tape
Wide (mm) Carrier Tape

Peel Strength:
Experience has shown us that consistent tape peel strength eliminates process start and stops and materials losses. Indium Corporation’s manufacturing procedures and quality assurance eliminates these customer concerns.
Alloys:
Solder spheres are available in many alloys including industry standards:
Sn63Pb37
Sn62Pb36Ag2
Pb90Sn10
Pb89.5Sn10.5

Production flow chart · Unclassified

SMT production solution

2000年9月5日2016年10月4日 ChinaFactory留下评论

With our four modern SMT (Surface Mount Technology) assembly lines,can assemble up to 86,500 components an hour at its Mönchengladbach site. We manufacture for our customers state-of-the-art designs – from very small 0201 components up to e.g. BGAs, µBGAs and QFPs with a fine pitch of 0.3 mm.

By investing regularly in up-to-date technologies, make sure our production keeps up with the state of the art. This ensures that we are able to offer our customers ultimate quality and the latest technologies.

The 4 SMT assembly lines at s.e.t. work as follows:

Automatic loading
Solder paste printing
Assembly
Reflow soldering
Automatic unloading
Automatic optical inspection

offer SMT solution for customers .Pls feel free contact us .

All the information thanks to s.e.t.

SOLDER BAR · Unclassified

SnCu0.7 lead free high temperature tin copper bar soldering

2000年8月25日2016年10月4日 ChinaFactory留下评论

SnCu0.7 lead free high temperature tin copper bar soldering

SnCu0.7 lead free high temperature bar soldering

Item bar solders			Sn99.3Cu0.7 bar solder
Appearance			Lucent, no dirt on surface of stick appearance
Size			(L×W×T×W):32cm×1.8cm×1.5cm×0.7kg/pc 20kg/carton
Chemistry component

Sn	Cu	In	Ag	Sb	Bi	Zn	Fe	Al	As	Cd
99.3±0.1	0.7±0.2	<0.01	<0.0001	<0.02	<0.01	<0.005	<0.02	<0.02	<0.03	<0.002

SCu07is a patented (US Patent No 4,929,423) lead-free alloy suitable for use as a replacement for Sn63 alloy in the wave solder process.

Why choose us?
Our products has the following advantages:
Good wet ability and expandability, and effectively prevent the phenomena of bridged linkage and icicle.
Efficient ability to dioxide film and to coat with quickly.Little spatter and smog, no smell, bright solder joints during soldering.
Little residue and high insulation resistance after soldering, excellent electrical performance, no-clean.

Range of application: widely used for manual soldering or automatic iron soldering operations, applicable to repair or the soldering of the electronic elements of electronic products.
1.    According to your product use, recommend the most suitable products for you
2.    According to your special requirements, design and manufacture of products
3.    Required to provide the goods according to the contract, if the goods due to our negligence appear problem, we provide a refund or a replacement

lead free solder item

No clean lead-free solder	melting point °C	Tensile strength	elongation reat%	expansion rate%	Diameter	Application	Solder wire alloy	Solder bar/block alloy	Solder paste alloy	Solder powder alloy
Sn99.3Cu0.7	227	30	45	70	≥0.1mm	low cost, the most commonly used; Lead-free solder for general welding	yes	yes	yes	yes
Sn96.5Ag3.0Cu0.5	217	40	58	78	≥0.1mm	high cost, relatively bright spot; high performenceCan be excellent for demanding welding	yes	yes	yes	yes

Sn99.0Ag0.3Cu0.7
Sn64Bi35Ag1	189	40	50	70		SMT,PCB	not	not	yes	yes
Sn62Pb36Ag2	189	38	54	75		SMT,PCB	not	not	yes	yes
Sn42Bi58	138	38	50	75	≥0.5mm	High cost	yes	yes	yes	yes

tin -lead alloy solder
Tin lead solder bar metal composition and application

Alloy composition Sn/Pb	Specific gravity	Liquid temperature	Temperature	Application
63/37	8.39	183	220~240	Computers, precision instruments, meters, TV, micro technology, coating metals
60/40	8.65	190	230~250
55/45	8.75	200	240~260	Calculators, tape recorders, telephones, quartz and other common electronic and electrical products
50/50	8.85	216	255~275
45/55	8.97	227	270~290
40/60	9.30	238	295~310	General circuit boards, toys, lamps, crafts, water tanks, plumbing solder

SOLDER BAR · Unclassified

Sn40Pb60 30/70 50/50 lead solder bar

2000年8月20日2019年6月13日 ChinaFactory留下评论

Sn40Pb60 30/70 50/50 lead solder bar factory in China

Sn50Pb50 Sn40Pb60 30/70 20/80lead solder bar of many metal tin lead alloy of the industry standard bar solder for use in high tech electronic applications.
Manufactured by a special process that controls the inclusions of oxides and metallic and non-metallic impurities, Sn50Pb50 Sn40Pb60 30/70 20/80lead solder bar can meet the industry standard of bar solder for use in high tech electronic applications where lower surface tension and hole filling ability are essential.
The purity of Sn50Pb50 Sn40Pb60 30/70 20/80lead solder bar/stick meets the requirements of IPC/J-STD-006C and will conform to these requirements when purchased directly or through stocking distributors.

Datasheet of Sn50Pb50,Sn40Pb60,Sn30Pb70,Sn20Pb80 tin lead solder bar for handling welding technique

Main content

w% Impurity

Standard

50±2

bal

≤0.10%

≤0.02%

≤0.05%

≤0.02%

≤0.001%

≤0.10%

≤0.001%

≤0.03%

≤0.01%

<0.01%

40±2

bal

≤0.20%

≤0.03%

0.05%

≤0.02%

≤0.001%

≤0.10%

≤0.001%

≤0.03%

≤0.01%

<0.01%

30±2

bal

≤0.10%

≤0.02%

0.05%

≤0.02%

≤0.001%

≤0.10%

≤0.001%

≤0.03%

≤0.01%

<0.01%

20±2

bal

≤0.10%

≤0.02%

0.05%

≤0.02%

≤0.001%

≤0.10%

≤0.001%

≤0.03%

≤0.01%

<0.01%

Result

51.2

bal

≤0.10%

≤0.02%

≤0.05%

≤0.02%

≤0.001%

≤0.10%

≤0.001%

≤0.03%

≤0.01%

<0.01%

38.3

bal

≤0.20%

≤0.03%

0.05%

≤0.02%

≤0.001%

≤0.10%

≤0.001%

≤0.03%

≤0.01%

<0.01%

31.5

bal

≤0.10%

≤0.02%

0.05%

≤0.02%

≤0.001%

≤0.10%

≤0.001%

≤0.03%

≤0.01%

<0.01%

19,3

bal

≤0.10%

≤0.02%

0.05%

≤0.02%

≤0.001%

≤0.10%

≤0.001%

≤0.03%

≤0.01%

<0.01%

Feedback:

We depend on our country reputation and customer satisfaction to succeed. Therefore, your feedback is extremely important to us.
If you like our items please leave me good feedback. Your action will help us offer our milk and bread. I will do the same for you.
Please contact us before leaving any negative of neutral feedback. We will work with you to solve any problems.
Return:
We provide 1 year warranty. If the item is defective, please notify us within 3 days of delivery.
All items must be returned in their original condition, in order to qualify for a refund or exchange of goods.
But shipping fee and insurance is not refundable.
Items returned after 7 days of delivery are only eligible for repair.
The buyer is responsible for all shipping costs incurred.
Sn50Pb50,Sn40Pb60,Sn30Pb70,Sn20Pb80 tin lead solder barbe used in all hand working,manual welding or handling soldering systems and will give excellent soldering performance and good value per joint.
Sn50Pb50,Sn40Pb60,Sn30Pb70,Sn20Pb80 tin lead solder barcould also be used for kinds of electronic components,e.g.PCB,phone,electric machine,wave machine etc.
Usually ues for handling welding stove to melting these low content of tin solder bar as follow:
Packing
Size:32×1.8×1.2×2.0 cm; weight 0.78-0.83kg/pc
Packing:10kg/crton; 30kg/export carton
Dimension of carton:36x26x18cm

SOLDER BAR · Unclassified

Sn63Pb37 63%Sn37%Pb tin lead alloy soldering bar

2000年8月18日2016年10月4日 ChinaFactory留下评论

tin lead alloy soldering bar

63%tin 37%lead soldering bar is manufactured using high purity raw materials and is treated using proprietary dross reducing technology to give a solder alloy that has Low Dross Characteristics.
Sn63Pb37 welding bar is manufactured using ultra high purity raw materials and the alloy is conditioned using proprietary viscosity and dross lowering treatments. This results in a pure, low drossing, high fluidity solder alloy, which is free of cast-in impurities and included oxides.
less tin dross and high purity high fluidity solder alloy of 63%Sn37%Pb tin lead alloy soldering bar the excellent welding result bar solders lead solder bar for wave soldering SMT PCB.

Feature:
1.    Favorable fatigue resistance and outstanding performance
2.    Ultra high electrical conductivity
3.    Mid-temperature soldering, characterized by nice softness and wonderful wetting property.
4.    Benefit from activated rosin core flux.
5.    Ultra strong oxygen resistance. Due to the anti-oxygen material in the solder wire,Sn63Pb37 no clean solder wire can give strong resistance to oxygen.Range of application: widely used for manual soldering or automatic iron soldering operations, applicable to repair or the soldering of the electronic elements of electronic products.

Low Dross Characteristics:giving cost effective use of the solder alloy.
Low Dross Characteristics:reducing the amount of dross in the wave pot leading to lower downturn and reducing the chance of oxide entrapped in joints.
Manufactured to Alpha’s high standards: giving a product that can be relied on to give good consistent soldering performance.

Chemical content:

Impurity content %

63±2

37+/2

≤0.10%

≤0.02%

0.1%

≤0.02%

≤0.001%

≤0.10%

≤0.001%

≤0.03%

≤0.01%

<0.01%

62.5

37.5

0.032

0.0002

0.0057

0.002

0.0015

0.006

0.0024

0.0021

0.0032

0.0001

Sn63Pb37 tin lead Bar Solder is designed to meet today’s sophisticated electronic manufacturing processes by providing a strong and reliable solder joint. All bar solder is manufactured from a variety of high purity virgin metals that exceed the IPC standards regarding impurity levels. Premium bar solder is manufactured in 1-pound and 1kg bars and sold in 50-pound boxes. Lead-free bar solder is sold in 20kg boxes. Other bar sizes are available upon request. We can also provide solder pot analysis.
Sn63Pb37 solder bar metal conten:

ELEMENT	CLEANWAVE	ISO 9453 1 Alloy 1	J-STD-006A 2 Sn63Pb37B	JIS Z3282A 3 H63A
Sn	62.5-63.5	62.5-63.5	62.5-63.5	62.5-63.5
Pb	Balance	Balance	Balance	Balance
Sb	0.12 max	0.12 max	0.20 max	0.12 max
Cu	0.05 max	0.05 max	0.08 max	0.05 max
Zn	0.001 max	0.001 max	0.003 max	0.002 max
Fe	0.01 max	0.02 max	0.02 max	0.02 max
As	0.01 max	0.03 max	0.03 max	0.03 max
Ni	0.01 max	Not specified	0.01 max	Not specified
Bi	0.10 max	0.10 max	0.10 max	0.10 max
Cd	0.001 max	0.002 max	0.002 max	0.002 max
Ag	0.10 max	Not specified	0.10 max	Not specified
Al	0.001 max	0.001 max	0.005 max	0.002 max
In	0.05 max	Not specified	0.10 max	Not specified

Tin lead solder bar as follow：

Alloy composition Sn/Pb	Specific gravity	Liquid temperature	Temperature	Application
70/30	8.67	195	230~250	Computers, precision instruments, meters, TV,
63/37	8.39	183	220~240	Computers, precision instruments, meters, TV,
60/40	8.65	190	230~250	micro technology, coating metals
55/45	8.75	200	240~260	Calculators, tape recorders, telephones, quartz and
50/50	8.85	216	255~275	other common electronic and electrical products
45/55	8.97	227	270~290	other common electronic and electrical products
40/60	9.30	238	295~310	General circuit boards, toys, lamps, crafts, water tanks, plumbing solder
30/70	9.70	260	310~325
20/80	10.05	275	325~335	General circuit boards, toys, lamps, crafts, water tanks, plumbing solder