Indium In97Ag3 Solder wire manufactuer in China with good price

2020年5月7日2020年5月7日 ChinaFactory留下评论

Indium Solder wire manufactuer in China with competive price

The indium In97Ag3 solder wire features 97% indium content and a few impurities less than 0.2g. It has good weldability and nice oxidation resistance. The wire features excellent weldability and oxidation resistance, making ideal for both wave soldering and dip soldering processes. Due to the high purity of the material, it provides outstanding fluidity during the soldering process and is widely used for die-attach applications.

Indium sodler wire Specifications

Item	Specification	Standard
Appearance	Smooth surface, no impurity
Alloy composition	InAg3 (Ag: 3%)
Liquidus temperature	About 144℃	DSC method
Sp. Gr.	7.40g/cm3
Tolerance of wire diameter	0.3-0.8±0.03mm; 0.8-2.5±0.05mm	GB/T 20422-2006
Application	Suitable for welding electronic parts
Package weight	By mutual agreement
Preservation method	Must be placed in a dry, non-corrosive environment without sunlight. Warranty for 2 years.

Alloy composition（%）

No.	Project	Result	Standard
1	Tensile test	Qualified	GB/T 28770-2012

Solderability test

In	Ag	Cu	Bi	Sb	Zn	Pb	Au	Ni	Fe
Remainder	2.5~3.5	≤0.05	≤0.10	≤0.10	≤0.001	≤0.10	≤0.05	0.01	≤0.02
As	Al	Cd	Total impurity
≤0.03	≤0.001	≤0.002	≤0.2

Indium Solder wire factory from China , Offer all kinds of solder products . Welcome to enquiry .

Solder wire

Sn42In58 Indium Solder wire Supplier

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The Sn42In58 indium solder wire features a tin content of 47.5~48.5% and minimal impurities (less than 0.2g). The wire features excellent weldability and oxidation resistance, making ideal for both wave soldering and dip soldering processes. Due to the high purity of the material, it provides outstanding fluidity during the soldering process and is widely used for die-attach applications.

Indium Solder wire factory from China , Offer all kinds of solder products .

Specifications

Item	Specification	Standard
Appearance	Smooth surface, no impurity
Alloy composition	S-Sn48In52	GB/T 20422-2006
Liquidus temperature	About 118℃	DSC method
Sp. Gr.	7.31g/cm3
Tolerance of wire diameter	0.3-0.8±0.03mm; 0.8-2.5±0.05mm	GB/T 20422-2006
Application	Suitable for welding electronic parts
Package weight	By mutual agreement	GB/T 20422-2006
Preservation method	Must be placed in a dry, non-corrosive environment without sunlight. Warranty for 2 years.

Alloy composition（%）

Sn	Ag	Cu	Bi	Sb	In	Zn	Pb	Au	Ni
47.5~48.5	≤0.10	≤0.05	≤0.10	≤0.10	Remainder	≤0.001	≤0.10	≤0.05	0.01
Fe	As	Al	Cd	Total impurity
≤0.02	≤0.03	≤0.001	≤0.002	≤0.2

Solderability test

No.	Project	Result	Standard
1	Tensile test	Qualified	GB/T 28770-2012

Solder wire

In99.9 Indium Solder wire manufacturer

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In99.9 Indium Solder wire factory from China , Offer all kinds of solder products

Specifications

Item	Specification	Standard
Appearance	Smooth surface, no impurity
Alloy composition	In9999	YS/T 257-2009
Liquidus temperature	About 156℃	DSC method
Sp. Gr.	7.31g/cm3
Tolerance of wire diameter	0.3-0.8±0.03mm; 0.8-2.5±0.05mm	GB/T 20422-2006
Application	Suitable for welding electronic parts
Package weight	By mutual agreement	GB/T 20422-2006
Preservation method	Must be placed in a dry, non-corrosive environment without sunlight. Warranty for 2 years.

Alloy composition（%）

In	Cu	Pb	Zn	Cd	Fe	Tl	Sn	As	Al
≥99.99	≤0.0005	≤0.001	≤0.0015	≤0.0015	≤0.0008	≤0.001	≤0.0015	≤0.0005	0.0007

Solderability test

No.	Project	Result	Standard
1	Tensile test	Qualified	GB/T 28770-2012

Indium wire · Low temperature solder wire · Solder products · Solder wire · Unclassified

Low-temperature solder wire is often used in electronics assembly, such as these applications

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Attachment of temperature-sensitive components to printed circuit boards
Step soldering, when a secondary, lower temperature reflow process is required after a standard SAC soldering process is completed
Eliminating warpage of thinner chips due to high-temperature reflow
Low melting or low-Tg flex circuitry which are used in cellphones, smartwatches, and many internet-of-things (IoT) devices
Large area array devices – such as BGAs – to avoid head-in-pillow (HIP) and non-wet-open (NWO) failures
Durafuse LT
Indium Corp has invented a new low-temperature solder paste called Durafuse LT. This new alloy reflows at 200°C and uses a novel solder alloy process to bring mid-temperature solder properties into the upper edge of the low-temperature space. This provides greater drop shock and thermal cycling performance as compared to the typical BiSnAg alloys currently on the market.
Older legacy low-temp options are brittle and tend to crack when stressed, which make them unsuitable for many applications. Durafuse LT is more robust and increases durability in drop shock, not just incrementally, but by a significant measure. In fact, under the right process conditions, Durafuse LT’s performance is comparable to SAC305.
Other low-temperature alloys include:

Indalloy #	Liquidus (^°C)	Solidus (^°C)	Element 1	%	Element 2	%	Element 3	%	Element 4	%
1E	118	118	In	52.0	Sn	48.0
1	125	118	In	50.0	Sn	50.0
71	131	118	Sn	52.0	In	48.0
281	138	138	Bi	58.0	Sn	42.0
282	140	139	Bi	57.0	Sn	42.0	Ag	1.0
290	143	143	In	97.0	Ag	3.0
87	145	118	Sn	58.0	In	42.0
203	150	125	In	95.0	Bi	5.0
88	150	150	In	99.3	Ga	0.7
225	151	143	In	90.0	Sn	10.0
90	152	152	In	99.4	Ga	0.6
91	153	153	In	99.6	Ga	0.4
2	154	149	In	80.0	Pb	15.0	Ag	5.0
92	154	154	In	99.5	Ga	0.5
4	157	157	In	100.0
204	175	165	In	70.0	Pb	30.0
205	181	173	In	60.0	Pb	40.0
231	186	174	Sn	86.5	Zn	5.5	In	4.5	Bi	3.5
227	187	175	Sn	77.2	In	20.0	Ag	2.8
226	187	181	Sn	83.6	In	8.8	Zn	7.6

Low-Temperature Solder Applications

In addition to soldering, Indium Corp provides low-temperature solutions for thermal management, hermetic sealing, fusible alloys, eye glass lens blocking, and more.

Thermal Management

Alloy systems that are liquid at room temperature have a high degree of thermal conductivity, far superior than ordinary non-metallic liquids. This allows for the use of these materials in specific heat-conducting applications, such as heat dissipation in sensitive components during operation, machining, and/or manufacturing.

Other advantages of these liquid alloy systems are their inherent electrical conductivity. Typical applications for these materials include thermostats, switches, barometers, heat transfer systems, and thermal cooling and heating designs.

Hermetic Sealing

Some sealing operations use pure indium and require no heat at all. The sealing process uses mechanical pressure to create the bond. The softness and malleability of indium, in addition to its ability to retain these characteristics at cryogenic temperatures, allows it to fill in imperfections in mating surfaces to create a hermetic seal.

Fusible Alloys

Low-temperature or fusible alloys are commonly used in a variety of safety devices where they are designed to melt at a peak temperature to initiate a process. Eye glass lens blocking is another application where low-temperature or fusible alloys work well. The lens is held in place using a block of the alloy, which is then easily removed with hot water.

Some common fusible alloys are:

	Indalloy
Property	117	158	160-190	217-440	255	281
Property	Indalloy 117	Indalloy 158	Indalloy 160-190	Indalloy 217-440	Indalloy 255	Indalloy 281
Melting Point or Range Deg/F	117	158	160-190	217-440	255	281
Weight lbs/in³	.32	.339	.341	.343	.380	.315
Tensile Strength lbs/in²	5,400	5,990	5,400	13,000	6,400	8,000
Brinell Hardness No.	12	9.2	9	19	10.2	22
Maximum Load 30 sec lbs/in²	—	10,000	9,000	16,000	8,000	15,000
Safe Load Sustained	—	300	300	300	300	500
Conductivity (Electrical) Compared with Pure Copper	3.34%	4.17%	4.27%	2.57%	1.75%	5.00%

We offer all kind of solder product , Pls feel free contact us.

Solder wire · Unclassified

Specifications for Solder Wire

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Product Description

To keep pace with rapid technological development in the electronic and electrical field Bhavani Metals manufactures Rosin Core solder Wire, ROHS Compliance Solder, Lead free solder, Solder Alloys, Silver Solder, Solder Paste and solder sticks with high grade pure virgin metals. Rigid analytical quality control procedure being exercised on every cast. Highly skilled technicians and engineers specialized in the field, properly check the quality and reliability of the rosin core solder wire, lead free solder & solder alloys to meet relevant standards.

Solder Wire can be supplied in Rosin activated / Urea based fluxes as per customer requirement in various Diameters upto 22 SWG with different combination of Tin / Lead / Silver / Cadimum / Antimony etc.

Solder Wire, Lead free Solder, Solder Sticks, Rosin Core Solder

Specifications for Solder Wire

SRI BHAVANI Solder wires are manufactured in Solid, Single and Five Cores of Flux. The flux is uniformly distributed throughout the longitudinal axis of the Solder. The fluxes used are activated non corrosive and of fast spreading action.
Only high purity virgin metals are used in the manufacture.
Available in various metal combinations of Tin, Lead, Silver, Zinc etc.
SRI BHAVANI Solder Wire and Sticks are generally confirming to I. S. 1921 and I.S.193.
Solder Wires are available upto 22 SWG diameters. Solder Stick are of standard size.
Solder Sticks with Tin, Lead and Zinc combinations for Aluminium Soldering are available.
Solder Anodes and other alloys are also manufactured as per customer`s specifications.

Common Alloys of Solder with Melting Ranges:

COMPOSITION				MELTING RANGE
TIN %	LEAD %	SILVER %	ZINC %	°C
20	80	–	–	183-275
30	70	–	–	183-255
40	60	–	–	183-234
50	50	–	–	183-212
60	40	–	–	183-188
63	37	–	–	183-183
62	36	2	–	178-178
45	53	–	2	170-215 Grade Sn Pb 53 Zn
40	58	–	2	175-220 Grade Sn Pb 58 Zn

Solder Alloy	Melting Solidus	Temp Liquidus	Uses
2/2/96 Sn/Sb/Pb	305	315	High Temperature
			High Creep Strength
5/93.5/1.5 Sn/Pb/Ag	296	301	High Melting Point
95/5 Sn Pb	236	243	High Melting Point
Pure tin Sn	232	232	Lead Free
15/85 Sn Pb	225	290	Lamps
96/4 Sn/Ag	221	221	Stainless Steel, Bright, Strong Non Toxic
20/80 Sn / Pb	183	275	Lamps
30/70 Sn/Pb	183	255	Lamps, Motors
31.2/67/1.8 Sn/Pb/Sb	185	243	Radiators, General Purpose Non Electrical
40/60/ Sn Pb	183	234	General Purpose
45/55 Sn/Pb	183	224	General Purpose
50/48.5/1.5 Sn/Pb/Cu	183	215	Saves Copper Erosion
50/49.7/0.3 Sn/Pb/Sb	183	212	General Purpose
50/50 Sn/Pb	183	212	General Purpose
60/39.7/0.3 Sn/Pb/Sb	183	188	General Purpose
60/40 Sn/Pb	183	188	Electrical
63/36.7/0.3 Sn/Pb/Sb	183	183	Electrical
62/35.7/2/0.3 Sn/Pb/Sb/Ag	179	179	Silver – Plated Surfaces
62/36/2 Sn/Pb/Ag	179	179	Silver – Plated Surfaces
18/80.1/1.9 Sn/Pb/Ag	178	270	Aluminium
50/32/18 Sn/Pb/Cd	145	145	Low melting point, Soldering on Gold
70/30 Sn/Zn	196	307	Spray Wire for Metal Film capacitors
80/20 Sn/Zn	196	268	Spray Wire for Metal Film capacitors
30/70 Sn/Cd	176	240	Low Thermal EMF Solder

Solder wire · Unclassified

Soft silver soldering wire Sn62Pb36Ag2 with 179degree melting

2000年6月19日2016年10月4日 ChinaFactory留下评论

silver soldering wire Sn62Pb36Ag2

During the processing of our‘No-Clean Solder Wire’, strict quality control management and the advanced drawing process are implemented. Meanwhile, the ratio of both trace metals and impurity substances in the wires are precisely controlled and the welding flux in the wires is distributed uniformly to insure welding continuity. Besides a clean and tidy packing as well as a bright and smooth surface,Sn62Pb36Ag2 soft soldering wire, in welding process, also provide excellent wettability and weldability, keeping the process in a friendly environment of few smell, few smoke, few flitting, and non-toxic environment.
Diameter :0.5mm0.6mm0.8mm1.0mm.2.0mm
Tolerance0.020.020.030.030.04
Net Weight0.5kg、1.0kg
All kinds of wires(e.g. tin-lead, lead-free, flux core, solid core)

Feature of Sn62Pb36Ag2 lead silver solder wire:
Nontoxic and environment friendly、Low melting point and stabilitytidiness surface and not easy to tienon-flux pollutionno dross residual.
1.Applied in the field of low temperature electronics surface mounting technology, Such as tin- Lead hand soldering, PCB secondary soldering. Application to thermal cut-off、thermal protector、Capacitors heating fuse, etc.

2. – CHEMICAL CHARACTERISTICS :

2.1 Amount of Tin : 62% ± 0.6%

2.2 Amount of Lead : 36% ±0.5%

2.3 Amount of Silver :2+/-0.5

2.3 Tin-lead-silver of first smelting purity

2.4 Chart of maximum impurities:

Sn	Ag	Pb	Pb	Bi	Fe	Zn	Al	As	Others
bal	2+/-0.5	36+/-1	0.10	0.10	0.02	0.001	0.2	0.03	0.05

2.4 Available types of incorporated flux:

Rosin Activated: RMA & RA

2.5 Amount of flux incorporated: BS441 Grades 1, 2 or 3

Sn62Pb36Ag2 middle melting soldering wire feature:
The middle-melting solder wire, provided with a lower melting point and easy to operate, is one of the mos energy saving solders for welding. It is commonly used in electronic components’ gradient welding as well as the welding of thebbienrmolabile parts such as LED, LCD, LNB, radiators, thermosensors, fire alarms, flexible plates, air-condition protectors and the parts for lightningproof and temperature control. In the solder wire, one of Compo’s unique technic known as the Metal Crystal Refinement Technology is adopted to toughen the Sn/Pb/Ag wire, eliminating its brittleness, thus providing the wire with a fine, clean and bright surface.