Low-temperature solder wire is often used in electronics assembly, such as these applications

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Attachment of temperature-sensitive components to printed circuit boards
Step soldering, when a secondary, lower temperature reflow process is required after a standard SAC soldering process is completed
Eliminating warpage of thinner chips due to high-temperature reflow
Low melting or low-Tg flex circuitry which are used in cellphones, smartwatches, and many internet-of-things (IoT) devices
Large area array devices – such as BGAs – to avoid head-in-pillow (HIP) and non-wet-open (NWO) failures
Durafuse LT
Indium Corp has invented a new low-temperature solder paste called Durafuse LT. This new alloy reflows at 200°C and uses a novel solder alloy process to bring mid-temperature solder properties into the upper edge of the low-temperature space. This provides greater drop shock and thermal cycling performance as compared to the typical BiSnAg alloys currently on the market.
Older legacy low-temp options are brittle and tend to crack when stressed, which make them unsuitable for many applications. Durafuse LT is more robust and increases durability in drop shock, not just incrementally, but by a significant measure. In fact, under the right process conditions, Durafuse LT’s performance is comparable to SAC305.
Other low-temperature alloys include:

Indalloy #	Liquidus (^°C)	Solidus (^°C)	Element 1	%	Element 2	%	Element 3	%	Element 4	%
1E	118	118	In	52.0	Sn	48.0
1	125	118	In	50.0	Sn	50.0
71	131	118	Sn	52.0	In	48.0
281	138	138	Bi	58.0	Sn	42.0
282	140	139	Bi	57.0	Sn	42.0	Ag	1.0
290	143	143	In	97.0	Ag	3.0
87	145	118	Sn	58.0	In	42.0
203	150	125	In	95.0	Bi	5.0
88	150	150	In	99.3	Ga	0.7
225	151	143	In	90.0	Sn	10.0
90	152	152	In	99.4	Ga	0.6
91	153	153	In	99.6	Ga	0.4
2	154	149	In	80.0	Pb	15.0	Ag	5.0
92	154	154	In	99.5	Ga	0.5
4	157	157	In	100.0
204	175	165	In	70.0	Pb	30.0
205	181	173	In	60.0	Pb	40.0
231	186	174	Sn	86.5	Zn	5.5	In	4.5	Bi	3.5
227	187	175	Sn	77.2	In	20.0	Ag	2.8
226	187	181	Sn	83.6	In	8.8	Zn	7.6

Low-Temperature Solder Applications

In addition to soldering, Indium Corp provides low-temperature solutions for thermal management, hermetic sealing, fusible alloys, eye glass lens blocking, and more.

Thermal Management

Alloy systems that are liquid at room temperature have a high degree of thermal conductivity, far superior than ordinary non-metallic liquids. This allows for the use of these materials in specific heat-conducting applications, such as heat dissipation in sensitive components during operation, machining, and/or manufacturing.

Other advantages of these liquid alloy systems are their inherent electrical conductivity. Typical applications for these materials include thermostats, switches, barometers, heat transfer systems, and thermal cooling and heating designs.

Hermetic Sealing

Some sealing operations use pure indium and require no heat at all. The sealing process uses mechanical pressure to create the bond. The softness and malleability of indium, in addition to its ability to retain these characteristics at cryogenic temperatures, allows it to fill in imperfections in mating surfaces to create a hermetic seal.

Fusible Alloys

Low-temperature or fusible alloys are commonly used in a variety of safety devices where they are designed to melt at a peak temperature to initiate a process. Eye glass lens blocking is another application where low-temperature or fusible alloys work well. The lens is held in place using a block of the alloy, which is then easily removed with hot water.

Some common fusible alloys are:

	Indalloy
Property	117	158	160-190	217-440	255	281
Property	Indalloy 117	Indalloy 158	Indalloy 160-190	Indalloy 217-440	Indalloy 255	Indalloy 281
Melting Point or Range Deg/F	117	158	160-190	217-440	255	281
Weight lbs/in³	.32	.339	.341	.343	.380	.315
Tensile Strength lbs/in²	5,400	5,990	5,400	13,000	6,400	8,000
Brinell Hardness No.	12	9.2	9	19	10.2	22
Maximum Load 30 sec lbs/in²	—	10,000	9,000	16,000	8,000	15,000
Safe Load Sustained	—	300	300	300	300	500
Conductivity (Electrical) Compared with Pure Copper	3.34%	4.17%	4.27%	2.57%	1.75%	5.00%

We offer all kind of solder product , Pls feel free contact us.

Solder products · Unclassified

Solder Balls or Solder Balling on a PCB

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25K pcs per bottle

Precision BGA Spheres Optimize Sphere Performancemanufactures solder spheres for PBGA, CBGA, TBGA, µBGA, and flip-chip applications. The solder spheres are made using a proprietary manufacturing process that provides consistently high sphericity and accurate diameters.

Indium Corporation can make almost any solder alloy sphere to suit customer needs. Standard alloys include both Pb-free and SnPb eutectic. Standard sphere diameters are commonly packaged in tape & reel and are listed below. We are constantly expanding and adapting our product offering to meet customer needs, so please contact us if you have a unique request.

inches
mm
0.024
0.610
0.035
0.889
0.062
1.57
Packaging:
We also offer two different standard diameter reels for tape & reel solder spheres

Sphere
Diameter (in) Maximum Spheres
Per 7″ Reel (K) Maximum Spheres
Per 13″ Reel Carrier Tape
Wide (mm) Carrier Tape

Peel Strength:
Experience has shown us that consistent tape peel strength eliminates process start and stops and materials losses. Indium Corporation’s manufacturing procedures and quality assurance eliminates these customer concerns.
Alloys:
Solder spheres are available in many alloys including industry standards:
Sn63Pb37
Sn62Pb36Ag2
Pb90Sn10
Pb89.5Sn10.5

Solder products · Unclassified

Lead free tin Solder paste type 7 silver solder paste SAC305

2000年2月12日2023年6月13日 ChinaFactory2条评论

Type 7 silver solder paste SAC305
Solder paste is a form of solder that is used in PCB assembly, and including prototype PCB assembly, especially when using reflow soldering techniques. The solder paste is a mixture a solder spheres and a specialized form of flux. This means that the solder forms a form of paste that can be printed onto the surface of the printed circuit card in the required.

type 7(2~12micron) solder paste SAC305 that is Sn96.5Ag3.0Cu0.5 is a no-clean formula. The residues do not need to be removed for typical applications. AlthoughSAC305 is designed for no-clean applications, its residues can be easily removed using automated cleaning equipment (in-line or batch) with a variety of readily available cleaning agents.
Clients Zone:
For now,our type 7 SACX305 solder paste expored to Israel,Canada,Germany,France,Mid-Eastern Asia countries,and part of Eastern European contries.
we are appreciated your kindly inquiry and cooperations with you,if you are interested in our items.
type seven Sn96.5Ag3.0Cu0.5 no clean solder paste does require refrigeration if left at room temperature 3-10 degree for 6 months shelf life.
type 7 Sn96.5Ag3.0Cu0.5 Solder paste basics
The solder particles are a mixture of solder. Traditionally this used to be tin and lead, but with the legislation being introduced around the world, there is a move to lead free solders. These may be made from a variety of mixtures. One is 96.5% tin and 3.0%silver and 0.5% copper, which has exllent soldering result performent.
supply type 7 Sn96.5Ag3.0Cu0.5 silver solder paste has following feature:
1)Can print down to 8 mil x 8 mil apertures
2) Designed specifically for fine feature printing with T7 powder
3)Low QFN/BGA voiding
4) Excellent solderability with halogen-free chemistry
5)Optimized flux residues to mitigate head-in-pillow defects
6)Capable of print speeds up to 6 in/sec (150mm/sec)
7)Low slump behavior minimizes defects
supply type 7 silver solder paste,just as the following specification,our solder paste are highly appreciated by clients arround the world.
Test Content–
Test Item Test Result Test Method
Copper Plate Corrosion Test Pass JIS-Z-3197, 8.4.1
Spread Test > 75% JIS-Z-3197, 8.3.1.1
Copper Mirror Test Pass IPC-TM-650, 2.3.32
Viscosity Test(25 °C,10rpm) 220 ± 30 Pa • s JIS-Z-3284. Annex 6
Tackiness Test (gf) > 130 (8hr) JIS-Z-3284. Annex 9
Slump Test Pass JIS-Z-3284. Annex 7, 8
Solder Ball Test Pass JIS-Z-3284. Annex 11
–Reliability Test–
S.I.R. Test ◊ > 1×109 Ω , Pass IPC-TM-650, 2.6.3.3
Electro Migration Test ♦ Pass IPC-TM-650, 2.6.14.1
◊ Test Conditions: 85 °C, 85% RH for 168 hrs ♦Test Conditions: 65 °C, 85% RH for 596 hrs
–Alloy Composition–
(Sn) (Ag) (Cu) (Ni) (Ge) (Zn) (Al) (Sb) (Fe) (As) (Bi) (Cd) (Pb)
REM. 2.8~3.2 0.3~0.7 0~0.01 0~0.01 0.001 MAX 0.001 MAX 0.05 MAX 0.02 MAX 0.03 MAX 0.10 MAX 0.002 MAX 0.05 M

Type 7 SAC305 solder paste REFLOW TIME PROFILE
Heating rate the time required to 120 ºC constant tem.
130 – 170ºC peak tem. > 220°C cooling rate
1-3 ºC/sec < 60—90secs 60—120secs < 245 ±5ºC < 40—80secs <4ºC / S
Storage, Handling, and Shelf Life:
Refrigeration is the recommended optimum storage condition fortype7 SAC305 lead free solder pasteto maintain consistent viscosity,reflow characteristics and overall performance. SAC305 lead free solder pasteshould be stabilized at room temperature prior to printing. SAC305 lead free solder pasteshould be kept at standard refrigeration conditions, 0-10°C (32-50°F). Please contact us if you require additional advice with regard storage and handling of this material. Shelf life is 6-10 months from date of manufacture when handled properly and held at 0-10°C (32-50°F).
Small knowledge of type 7 Sn96.5Ag3.0Cu0.5 silver lead free solder paste
How to use solder paste
When solder paste is used in mass PCB assembly as well as prototype PCB assembly there are a number of stages that are undertaken. First solder paste is applied to the printed circuit boards. The solder paste is only applied to the areas where solder is required. This is achieved using a solder paste stencil that only allows the solder paste through in certain areas. (Further information is available on another page in this section of the website).

Once the solder paste has been applied to the printed circuit board, it is then passed into the pick and place machine where the components are added. The solder paste has sufficient tension that it holds the components in place. However care should be taken not to knock the board at this stage otherwise the components may move of fall off. Additionally the board should be soldered within a few hours of being placed, otherwise the solder paste may deteriorate.
Any further information,please feel free to consult technician team.
Application of type7 SAC305 solder paste:
1)can supply jar packing of 500g used for stenciling solder technique,SMD,SMT technology.
2) can supply syring tube packing of 100g,which is used for dispensing technique,for some high quality electronics.
type7 solder paste packing Details:
Packing could be classified as can/bottle packing and syringe packing type.
Each can/bottle holds the solder cream is 500g;
Each syringe can load the solder cream is 100g
The packing materials can be separated into inner layer of a bubble box and outer package of a paper carton so as to better secure for shipping and transportation.
Specification Sn96.5Ag3.0Cu0.5 type7
Appearance gray tacky paste
Weight 500g/jar or 100g/syringe;10kg/carton
we are solder wire,solder paste,solder power,solder bar, flux, red glue,and so on , please feel free contact us .