Low-temperature solder wire is often used in electronics assembly, such as these applications

2010年6月20日2023年6月20日 ChinaFactory留下评论

Attachment of temperature-sensitive components to printed circuit boards
Step soldering, when a secondary, lower temperature reflow process is required after a standard SAC soldering process is completed
Eliminating warpage of thinner chips due to high-temperature reflow
Low melting or low-Tg flex circuitry which are used in cellphones, smartwatches, and many internet-of-things (IoT) devices
Large area array devices – such as BGAs – to avoid head-in-pillow (HIP) and non-wet-open (NWO) failures
Durafuse LT
Indium Corp has invented a new low-temperature solder paste called Durafuse LT. This new alloy reflows at 200°C and uses a novel solder alloy process to bring mid-temperature solder properties into the upper edge of the low-temperature space. This provides greater drop shock and thermal cycling performance as compared to the typical BiSnAg alloys currently on the market.
Older legacy low-temp options are brittle and tend to crack when stressed, which make them unsuitable for many applications. Durafuse LT is more robust and increases durability in drop shock, not just incrementally, but by a significant measure. In fact, under the right process conditions, Durafuse LT’s performance is comparable to SAC305.
Other low-temperature alloys include:

Indalloy #	Liquidus (^°C)	Solidus (^°C)	Element 1	%	Element 2	%	Element 3	%	Element 4	%
1E	118	118	In	52.0	Sn	48.0
1	125	118	In	50.0	Sn	50.0
71	131	118	Sn	52.0	In	48.0
281	138	138	Bi	58.0	Sn	42.0
282	140	139	Bi	57.0	Sn	42.0	Ag	1.0
290	143	143	In	97.0	Ag	3.0
87	145	118	Sn	58.0	In	42.0
203	150	125	In	95.0	Bi	5.0
88	150	150	In	99.3	Ga	0.7
225	151	143	In	90.0	Sn	10.0
90	152	152	In	99.4	Ga	0.6
91	153	153	In	99.6	Ga	0.4
2	154	149	In	80.0	Pb	15.0	Ag	5.0
92	154	154	In	99.5	Ga	0.5
4	157	157	In	100.0
204	175	165	In	70.0	Pb	30.0
205	181	173	In	60.0	Pb	40.0
231	186	174	Sn	86.5	Zn	5.5	In	4.5	Bi	3.5
227	187	175	Sn	77.2	In	20.0	Ag	2.8
226	187	181	Sn	83.6	In	8.8	Zn	7.6

Low-Temperature Solder Applications

In addition to soldering, Indium Corp provides low-temperature solutions for thermal management, hermetic sealing, fusible alloys, eye glass lens blocking, and more.

Thermal Management

Alloy systems that are liquid at room temperature have a high degree of thermal conductivity, far superior than ordinary non-metallic liquids. This allows for the use of these materials in specific heat-conducting applications, such as heat dissipation in sensitive components during operation, machining, and/or manufacturing.

Other advantages of these liquid alloy systems are their inherent electrical conductivity. Typical applications for these materials include thermostats, switches, barometers, heat transfer systems, and thermal cooling and heating designs.

Hermetic Sealing

Some sealing operations use pure indium and require no heat at all. The sealing process uses mechanical pressure to create the bond. The softness and malleability of indium, in addition to its ability to retain these characteristics at cryogenic temperatures, allows it to fill in imperfections in mating surfaces to create a hermetic seal.

Fusible Alloys

Low-temperature or fusible alloys are commonly used in a variety of safety devices where they are designed to melt at a peak temperature to initiate a process. Eye glass lens blocking is another application where low-temperature or fusible alloys work well. The lens is held in place using a block of the alloy, which is then easily removed with hot water.

Some common fusible alloys are:

	Indalloy
Property	117	158	160-190	217-440	255	281
Property	Indalloy 117	Indalloy 158	Indalloy 160-190	Indalloy 217-440	Indalloy 255	Indalloy 281
Melting Point or Range Deg/F	117	158	160-190	217-440	255	281
Weight lbs/in³	.32	.339	.341	.343	.380	.315
Tensile Strength lbs/in²	5,400	5,990	5,400	13,000	6,400	8,000
Brinell Hardness No.	12	9.2	9	19	10.2	22
Maximum Load 30 sec lbs/in²	—	10,000	9,000	16,000	8,000	15,000
Safe Load Sustained	—	300	300	300	300	500
Conductivity (Electrical) Compared with Pure Copper	3.34%	4.17%	4.27%	2.57%	1.75%	5.00%

We offer all kind of solder product , Pls feel free contact us.

Low temperature solder wire · Unclassified

Low temperature solder wire SN BI tin bismuth wire

2000年8月2日2016年10月4日 ChinaFactory一条评论

Low temperature BI tin bismuth solder wire

179degree melting tin-bismuth-silver solder wire Sn64Bi35Ag1

Tin-Bismuth-silver(Sn64Bi35Ag1) solder wire, with a melting point of 179 degrees C, is ideal for soldering of temperature sensitive components. Supplied as a solid core (no inner flux core) lead free solder wire, this solder gives good wetting and solder flow. Packaged as a 1000g box this solder wire we recommend using with the PF670 flux gel to promote increased rapid wetting.

Low temperature eutectic Tin Bismuth alloy
Prevents thermal damage to heat sensitive devices
Low to non-toxic lead free solder
Available currently in a 0.5mm,0.6mm,0.8mm,1.2mm and 2.0mm diameter.
Packing：1kg/case

Feature of Sn64Bi35Ag1 no flux core Bismuth solder wire

The most popular lead-free bismuth solder alloys are BBI-W104 (58Bi 42Sn) which melts at 138°C and BBI-W105 (Sn64-Bi35Ag1) which melts at 179°C. The addition of the 1% Ag makes the alloy more malleable. Both alloys can be used for step soldering applications. After the initial joints are made with a standard SAC alloy (220°C) subsequent soldering operations can be done using the bismuth alloys.
Sn64Bi35Ag Bi solder wire has joint properties similar to those of tin-lead solders, with superior fatigue and copper dissolution characteristics.
Bismuth is the most diamagnetic and the least thermally conductive of all metals
In addition to being non-toxic it does not oxidize as readily as lead does.
Feature of other solder wire is also available for Low temperature eutectic Tin Bismuth silver alloy:
Excellent scalability
High quality soldering wire on the market
Refined welding good fluidity, wetting, smoke spatter
Excellent First Pass Solder Joints. JIS Spread ≥ 80%.
Quick acting flue dissolves surface oxides for good wetting
Good solderability, insulation resistance, No spattering and Non-corrosive.
Widely used in electrical and electronics, solder parts like circuit board, electronics devices and others.

More than 10 years specialized in metal industry, accumulated a lot of talent and technology, created international marketing network, for now, have cooperated with many of oversea enterprises of over 80 countries around the world.e.g.America,Israel,India,Germany,Russia,Poland,LTU,Switzerland,Korea,Romannia,Bulgaria,Colombia,France etc.
Specification of Sn/Bi/Ag low temperature solder wire:
Item： Low temperature solder wire
Specification: BBI-W105(Sn64Bi35Ag1)
1. Purity and chemistry component

Specification	Sn64Bi35Ag1- no flux core solder wire
Appearance	Lucent,no dirt on surface
Weight	Net: 500g/case;1000g/case
Chemistry component
Elements Specification(%) Tested result(%WT) Sn 63.0~65.0 64.0 Ag 0.8~1.2 1.0 Al 0.005 0.0003 As 0.030 0.0060 Sb 0.050 0.0148 Bi Remainder Remainder Cu 0.080 0.0003 Fe 0.010 0.0003 In 0.050 0.0019 Ni 0.010 0.0007 Pb 0.050 0.0257 Cd 0.002 0.0002 Au 0.050 0.0010 Ag 0.050 0.0002
a. The above concentration of specification are in % weight. b. Single value listed are the maximum allowable standard.Flux content(%): 0 Diameter of wire: 0.5mm,0.6mm,0.8mm,1.0mm,1.2mm and 2.0mm

Physical feature of Sn64Bi35Ag1 solid solder wire

Alloy component	Melting point℃	Working temperature℃	Gravity g/cm³	Rigidity HB	Conduct heat M.S.K	Extend Mpa	Extend rate %	Conductivity %
Sn64Bi35Ag1	179	100~210	8.5~8.7	11~12	68	45	70-100	18.0

The more informations about Sn64Bi35Ag1 middle temperature metiong lead free solder wire,please feel freely contact with us.

Sn64Bi35Ag1 and other tin bismuth wire Application:

Advantages of Bismuth-based Alloys for Low Temperature Pb-free Soldering and Rework.
More and more requirment for middle and low temperature solder wire for moblie electronics,smart-home electronics..

The increased function of personal electronic devices, such as mobile phones and personal music devices, has driven the need for smaller and smaller active and passive components. This trend toward miniaturization, occurring at the same time as the conversion to RoHS-compliant lead-free assembly, has been a considerable challenge to the electronics assembly industry. The main reason for this is the higher reflow process temperatures required for Pb-free assembly. These higher temperatures can thermally damage the PCB and the components. In addition, the higher reflow temperatures can negatively affect the solder joint quality, especially when coupled with the smaller paste deposits required for these smaller components. If additional thermal processing is required, the risk increases even more.

Packing of tin-bismuth-silver solder wire

Product Type	Solder wire Sn64Bi35Ag

Material	Tin-Bismuth-Silver alloy
Composition	tin64%,bismuth 35%,silver 1%
Melt point	179degree
Flux content	no flux
Application	Metal soldering,electronics
Density (g/m^3)	8.3
Diameter	0.5mm，0.7mm,0.8mm,1.0mm,1.2mm,2.0mm
Packing	500g/case,1kg/case
Type	no flux core solder wire
Place of origin	Shenzhen,Dongguan city

Keyword	Tin bismuth silver lead free no flux core solder wire
	Solder wire,tin bismuth solder wire,no flux core solder wire Sn64Bi35Ag1
	solder

Low temperature solder wire · Unclassified

Solder wire low temperature 179 degree melting tin bismuth silver solder wire Sn64Bi35Ag1

2000年4月10日2016年10月4日 ChinaFactory留下评论

Solder wire low temperature 179 degree melting tin bismuth silver solder wire Sn64Bi35Ag1

With the development requirement of world environmental protection,lead free solder wire will gradually replace the tin-lead solder wires. apply for the advanced technology, do research and development more and more special and very usefully lead free solder wire,low temperature solder wire,Tin Bismuth solder wire.
Tin-Bismuth-silver(Sn64Bi35Ag1) solder wire, with a melting point of 179 degrees C, is ideal for soldering of temperature sensitive components. Supplied as a solid core (no inner flux core) lead free solder wire, this solder gives good wetting and solder flow. Packaged as a 1000g box this solder wire we recommend using with the PF670 flux gel to promote increased rapid wetting.

supply Sn64Bi35Ag1 tin bismuth silver solder wire,lead free low temperature solder wire,It has following feature.

Feature of Sn64Bi35Ag1 no flux core Bismuth solder wire

The most popular lead-free bismuth solder alloys are BBI-W104 (58Bi 42Sn) which melts at 138°C and BBI-W105 (Sn64-Bi35Ag1) which melts at 179°C. The addition of the 1% Ag makes the alloy more malleable. Both alloys can be used for step soldering applications. After the initial joints are made with a standard SAC alloy (220°C) subsequent soldering operations can be done using the bismuth alloys.
Sn64Bi35Ag Bi solder wire has joint properties similar to those of tin-lead solders, with superior fatigue and copper dissolution characteristics.
Bismuth is the most diamagnetic and the least thermally conductive of all metals
In addition to being non-toxic it does not oxidize as readily as lead does.

Feature of other solder wire is also available for Low temperature eutectic Tin Bismuth silver alloy:
Excellent scalability
High quality soldering wire on the market
Refined welding good fluidity, wetting, smoke spatter
Excellent First Pass Solder Joints. JIS Spread ≥ 80%.
Quick acting flue dissolves surface oxides for good wetting
Good solderability, insulation resistance, No spattering and Non-corrosive.
Widely used in electrical and electronics, solder parts like circuit board, electronics devices and others.

The more informations about Sn64Bi35Ag1 middle temperature metiong lead free solder wire,please feel freely contact

an experienced and professional Chinese soldering manufacturer. We are specializing in research and development, production and selling of the soldering tin materials (solder wire, solder paste, solder bar/stick etc).

More than 10 years specialized in metal industry, accumulated a lot of talent and technology, created international marketing network, for now, we have cooperated with many of oversea enterprises of over 80 countries around the world.e.g.America,Israel,India,Germany,Russia,Poland,LTU,Switzerland,Korea,Romannia,Bulgaria,Colombia,France etc.
Specification of Sn/Bi/Ag low temperature solder wire:
Item： Low temperature solder wire
Specification: BBI-W105(Sn64Bi35Ag1)
1. Purity and chemistry component

Specification	Sn64Bi35Ag1- no flux core solder wire
Appearance	Lucent,no dirt on surface
Weight	Net: 500g/case;1000g/case
Chemistry component
Elements Specification(%) Tested result(%WT) Sn 63.0~65.0 64.0 Ag 0.8~1.2 1.0 Al 0.005 0.0003 As 0.030 0.0060 Sb 0.050 0.0148 Bi Remainder Remainder Cu 0.080 0.0003 Fe 0.010 0.0003 In 0.050 0.0019 Ni 0.010 0.0007 Pb 0.050 0.0257 Cd 0.002 0.0002 Au 0.050 0.0010 Ag 0.050 0.0002
a. The above concentration of specification are in % weight. b. Single value listed are the maximum allowable standard.Flux content(%): 0 Diameter of wire: 0.5mm,0.6mm,0.8mm,1.0mm,1.2mm and 2.0mm

Physical feature of Sn64Bi35Ag1 solid solder wire

Alloy component	Melting point℃	Working temperature℃	Gravity g/cm³	Rigidity HB	Conduct heat M.S.K	Extend Mpa	Extend rate %	Conductivity %
Sn64Bi35Ag1	179	100~210	8.5~8.7	11~12	68	45	70-100	18.0

The more informations about Sn64Bi35Ag1 middle temperature metiong lead free solder wire,please feel freely contact us.

Sn64Bi35Ag1 and other tin bismuth wire Application:

Tin Bismuth Silver solder wire useage.

Packing of tin-bismuth-silver solder wire

Product Type	Solder wire Sn64Bi35Ag

Material	Tin-Bismuth-Silver alloy
Composition	tin64%,bismuth 35%,silver 1%
Melt point	179degree
Flux content	no flux
Application	Metal soldering,electronics
Density (g/m^3)	8.3
Diameter	0.5mm，0.7mm,0.8mm,1.0mm,1.2mm,2.0mm
Packing	500g/case,1kg/case
Type	no flux core solder wire
Place of origin	Shenzhen,Dongguan city

Keyword	Tin bismuth silver lead free no flux core solder wire
	Solder wire,tin bismuth solder wire,no flux core solder wire Sn64Bi35Ag1
	solder

The more informations about Sn64Bi35Ag1 middle temperature metiong lead free solder wire,please feel freely contact us .