Low-temperature solder wire is often used in electronics assembly, such as these applications

• Attachment of temperature-sensitive components to printed circuit boards
• Step soldering, when a secondary, lower temperature reflow process is required after a standard SAC soldering process is completed
• Eliminating warpage of thinner chips due to high-temperature reflow
• Low melting or low-Tg flex circuitry which are used in cellphones, smartwatches, and many internet-of-things (IoT) devices
• Large area array devices – such as BGAs – to avoid head-in-pillow (HIP) and non-wet-open (NWO) failures
• Durafuse LT
• Indium Corp has invented a new low-temperature solder paste called Durafuse LT.  This new alloy reflows at 200°C and uses a novel solder alloy process to bring mid-temperature solder properties into the upper edge of the low-temperature space. This provides greater drop shock and thermal cycling performance as compared to the typical BiSnAg alloys currently on the market.
• Older legacy low-temp options are brittle and tend to crack when stressed, which make them unsuitable for many applications. Durafuse LT is more robust and increases durability in drop shock, not just incrementally, but by a significant measure. In fact, under the right process conditions, Durafuse LT’s performance is comparable to SAC305.
• Other low-temperature alloys include:

Indalloy #	Liquidus (°C)	Solidus (°C)	Element 1	%	Element 2	%	Element 3	%	Element 4	%
1E	118	118	In	52.0	Sn	48.0
1	125	118	In	50.0	Sn	50.0
71	131	118	Sn	52.0	In	48.0
281	138	138	Bi	58.0	Sn	42.0
282	140	139	Bi	57.0	Sn	42.0	Ag	1.0
290	143	143	In	97.0	Ag	3.0
87	145	118	Sn	58.0	In	42.0
203	150	125	In	95.0	Bi	5.0
88	150	150	In	99.3	Ga	0.7
225	151	143	In	90.0	Sn	10.0
90	152	152	In	99.4	Ga	0.6
91	153	153	In	99.6	Ga	0.4
2	154	149	In	80.0	Pb	15.0	Ag	5.0
92	154	154	In	99.5	Ga	0.5
4	157	157	In	100.0
204	175	165	In	70.0	Pb	30.0
205	181	173	In	60.0	Pb	40.0
231	186	174	Sn	86.5	Zn	5.5	In	4.5	Bi	3.5
227	187	175	Sn	77.2	In	20.0	Ag	2.8
226	187	181	Sn	83.6	In	8.8	Zn	7.6

Low-Temperature Solder Applications

In addition to soldering, Indium Corp provides low-temperature solutions for thermal management, hermetic sealing, fusible alloys, eye glass lens blocking, and more.

Thermal Management

Alloy systems that are liquid at room temperature have a high degree of thermal conductivity, far superior than ordinary non-metallic liquids. This allows for the use of these materials in specific heat-conducting applications, such as heat dissipation in sensitive components during operation, machining, and/or manufacturing.

Other advantages of these liquid alloy systems are their inherent electrical conductivity. Typical applications for these materials include thermostats, switches, barometers, heat transfer systems, and thermal cooling and heating designs.

Hermetic Sealing

Some sealing operations use pure indium and require no heat at all. The sealing process uses mechanical pressure to create the bond. The softness and malleability of indium, in addition to its ability to retain these characteristics at cryogenic temperatures, allows it to fill in imperfections in mating surfaces to create a hermetic seal.

Fusible Alloys

Low-temperature or fusible alloys are commonly used in a variety of safety devices where they are designed to melt at a peak temperature to initiate a process. Eye glass lens blocking is another application where low-temperature or fusible alloys work well. The lens is held in place using a block of the alloy, which is then easily removed with hot water.

Some common fusible alloys are:

	Indalloy
Property	117	158	160-190	217-440	255	281
Property	Indalloy 117	Indalloy 158	Indalloy 160-190	Indalloy 217-440	Indalloy 255	Indalloy 281
Melting Point or Range Deg/F	117	158	160-190	217-440	255	281
Weight lbs/in3	.32	.339	.341	.343	.380	.315
Tensile Strength lbs/in2	5,400	5,990	5,400	13,000	6,400	8,000
Brinell Hardness No.	12	9.2	9	19	10.2	22
Maximum Load 30 sec lbs/in2	—	10,000	9,000	16,000	8,000	15,000
Safe Load Sustained	—	300	300	300	300	500
Conductivity (Electrical) Compared with Pure Copper	3.34%	4.17%	4.27%	2.57%	1.75%	5.00%

We offer all kind of solder product , Pls feel free contact us.