SACX0307 wave soldering stick tin bar

Item bar solders			Sn99-Ag0.3-Cu0.7 bar solder
Appearance			Lucent, no dirt on surface of stick appearance
Size			(L×W×T×W):32cm×1.8cm×1.5cm×0.7kg/pc 20kg/carton
Chemistry component
Sn	Ag	Cu	Pb	Sb	Bi	Zn	Fe	Al	As	Cd
99	0.3+/-0.1	0.7±0.2	<0.01	<0.02	<0.01	<0.02	<0.02	<0.02	<0.03	<0.002

SACX0307 is a patented (US Patent No 4,929,423) lead-free alloy suitable for use as a replacement for Sn63 alloy in the wave solder process.

SAC0307 soldering bar used to stabilize / reduce the copper content in the wave solder bar, this requirement will depend on process conditions. As with all  Metals bar solder,B proprietary  alloying process is used to remove certain impurities, particularly oxides.
PCB soldering

Lead-Free Compound

Lead-free soldering barcomprised of various combinations of tin, copper, silver and antimony. Pure tin wire has the highest melting point of 449 degrees. Other combinations of metals melt in a range between 419 and 441 degrees.It is used for wave soldering technique and handling solder.

SAC plus0307 solder stick/bar description:
SACX plus0307 is a patented (US Patent No 4,929,423) lead-free alloy suitable for use as a replacement for Sn63 alloy in the wave solder process. The SACX plus0307 variant is used to stabilize / reduce the copper content in the wave solder bath, this requirement will depend on process conditions. As with all our Metals bar solder, our technician alloying process is used to remove certain impurities, particularly oxides. The product is further enhanced with the addition of 2 minor elements to reduce dross formation and improve the joint cosmetics.
SACX Plus^® 0307 also delivers the same high yield wave soldering and reliability performance as the original. As with all SACX alloys, minimal solder dross is also produced due to our proprietary Vaculoy^® manufacturing process and the addition of just the right amount of proprietary additives.

Lead freesolder item:

No clean lead-free solder wire	melting point °C	Tensile strength	elongation reat%	expansion rate%	Diameter	Application	Solder wire alloy	Solder bar alloy	Solder paste alloy	Solder powder alloy
Sn99.3Cu0.7	227	30	45	70	≥0.1mm	low cost, the most commonly used; Lead-free solder for general welding	yes	yes	yes	yes
Sn96.5Ag3.0Cu0.5	217	40	58	78	≥0.1mm	high cost, relatively bright spot; high performenceCan be excellent for demanding welding	yes	yes	yes	yes
Sn99.95
Sn99.0Ag0.3Cu0.7
Sn42Bi58	138	38	50	75	≥0.5mm	High cost	yes	yes	yes	yes

Tin-lead alloy bar solders

SACX pluso3o7 solder bar is suitable for wave soldering and surface mount applications for electronic assemblers interested in implementing a lead-free process. It is suited to single side and mixed technology boards.Soldering bar(tin solder bar ) is applicable to various high temperature soldering, especially siver solder bar good in inductance wires, transformer and other industries. The alloy composition can be changed according to specific requirement.Apply forComputers, precision instruments, meters, TV, micro technology, coating metals.SACX plus0307 stick is optimized for use in wave and rework operations. Special additives minimize copper erosion during long, hot rework cycles.

Alloy composition Sn/Pb	Specific gravity	Liquid  temperature	Temperature	Application
63/37	8.39	183	220~240	Computers, precision   instruments, meters, TV, micro technology, coating metals
60/40	8.65	190	230~250
55/45	8.75	200	240~260	Calculators, tape recorders, telephones, quartz and other common electronic and electrical products
50/50	8.85	216	255~275
45/55	8.97	227	270~290
40/60	9.30	238	295~310	General circuit boards, toys, lamps, crafts, water tanks, plumbing solder