Low temperature solder wire SN BI tin bismuth wire

Low temperature  BI tin bismuth solder wire

179degree melting tin-bismuth-silver solder wire Sn64Bi35Ag1

Tin-Bismuth-silver(Sn64Bi35Ag1) solder wire, with a melting point of 179 degrees C, is ideal for soldering of temperature sensitive components. Supplied as a solid core (no inner flux core) lead free solder wire, this solder gives good wetting and solder flow. Packaged as a 1000g box this solder wire we recommend using with the PF670 flux gel to promote increased rapid wetting.

Low temperature eutectic Tin Bismuth alloy
Prevents thermal damage to heat sensitive devices
Low to non-toxic lead free solder
Available currently in a 0.5mm,0.6mm,0.8mm,1.2mm and 2.0mm diameter.
Packing：1kg/case

Feature of Sn64Bi35Ag1 no flux core Bismuth solder wire

• The most popular lead-free bismuth solder alloys are BBI-W104 (58Bi 42Sn) which melts at 138°C and BBI-W105 (Sn64-Bi35Ag1) which melts at 179°C. The addition of the 1% Ag makes the alloy more malleable. Both alloys can be used for step soldering applications. After the initial joints are made with a standard SAC alloy (220°C) subsequent soldering operations can be done using the bismuth alloys.
• Sn64Bi35Ag Bi solder wire has joint properties similar to those of tin-lead solders, with superior fatigue and copper dissolution characteristics.
• Bismuth is the most diamagnetic and the least thermally conductive of all metals
• In addition to being non-toxic it does not oxidize as readily as lead does. 

  Feature of other solder wire is also available for Low temperature eutectic Tin Bismuth silver alloy:
  Excellent scalability
  High quality soldering wire on the market
  Refined welding good fluidity, wetting, smoke spatter
  Excellent First Pass Solder Joints. JIS Spread ≥ 80%.
  Quick acting flue dissolves surface oxides for good wetting
  Good solderability, insulation resistance, No spattering and Non-corrosive.
  Widely used in electrical and electronics, solder parts like circuit board, electronics devices and others.

• More than 10 years specialized in metal industry, accumulated a lot of talent and technology, created international marketing network, for now, have cooperated with many of oversea enterprises of over 80 countries around the world.e.g.America,Israel,India,Germany,Russia,Poland,LTU,Switzerland,Korea,Romannia,Bulgaria,Colombia,France etc.
  Specification of Sn/Bi/Ag low temperature solder wire:
  Item：                 Low temperature solder wire
  Specification:            BBI-W105(Sn64Bi35Ag1)
  1. Purity and chemistry component

  Specification	Sn64Bi35Ag1- no flux core solder wire
  Appearance	Lucent,no dirt on surface
  Weight	Net: 500g/case;1000g/case
  Chemistry component
  Elements    Specification(%)       Tested result(%WT) Sn                63.0~65.0                       64.0 Ag                0.8~1.2                           1.0 Al                 0.005                            0.0003 As                0.030                            0.0060 Sb                0.050                           0.0148 Bi                Remainder                    Remainder Cu                0.080                           0.0003 Fe                0.010                           0.0003 In                0.050                             0.0019 Ni                0.010                            0.0007 Pb                0.050                           0.0257 Cd                0.002                           0.0002 Au                0.050                           0.0010 Ag                0.050                           0.0002
  a.       The above concentration of specification are in % weight. b.       Single value listed are the maximum allowable standard.Flux content(%): 0 Diameter of wire: 0.5mm,0.6mm,0.8mm,1.0mm,1.2mm and 2.0mm

  Physical feature of Sn64Bi35Ag1 solid solder wire

  Alloy component	Melting point℃	Working temperature℃	Gravity g/cm3	Rigidity  HB	Conduct heat M.S.K	Extend Mpa	Extend rate %	Conductivity  %
  Sn64Bi35Ag1	179	100~210	8.5~8.7	11~12	68	45	70-100	18.0

  The more informations about Sn64Bi35Ag1 middle temperature metiong lead free solder wire,please feel freely contact with us.

  Sn64Bi35Ag1 and other tin bismuth wire Application:

  Advantages of Bismuth-based Alloys for Low Temperature Pb-free Soldering and Rework.
  More and more requirment for middle and low temperature solder wire for moblie electronics,smart-home electronics..

  The increased function of personal electronic devices, such as mobile phones and personal music devices, has driven the need for smaller and smaller active and passive components. This trend toward miniaturization, occurring at the same time as the conversion to RoHS-compliant lead-free assembly, has been a considerable challenge to the electronics assembly industry. The main reason for this is the higher reflow process temperatures required for Pb-free assembly. These higher temperatures can thermally damage the PCB and the components. In addition, the higher reflow temperatures can negatively affect the solder joint quality, especially when coupled with the smaller paste deposits required for these smaller components. If additional thermal processing is required, the risk increases even more.

Packing of tin-bismuth-silver solder wire