Halogen free solder paste type4 Sn 3.0Ag 0.5Cu
Guaranteed melting even for fine patterns
Usually thinner metal masks have a smaller amount of printed solder paste, resulting in lower thermal resistance and higher occurrence of unmolten solder. S3X05 is an easy-to-use solder paste where even a small amount melts well.
Effectively prevents “head-in-pillow” defects
S3X58-Sn 3.0Ag 0.5Cu easily coalesces with BGA balls even after left molten for 60 seconds. This proves the high thermal resistance of the solder paste where its activity is maintained for a long period of time even at high temperature, preventing “head-in-pillow” defects.this make your solder better than ever .
Improved stencil separation
The smaller solder powder size is,the bigger shear stress from the stencil surface becomes,thus making it vulnerable to printing failure In Sn 3.0Ag 0.5Cu solder paste ,lubricant additives in the flux attach to the aperture walls, and help solder paste separate from the stencil, enabling printing in high aspect ratio apertures. SAC305 will be much better than Original models .
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