Solder wire low temperature 179 degree melting tin bismuth silver solder wire Sn64Bi35Ag1

Solder wire low temperature 179 degree melting tin bismuth silver solder wire Sn64Bi35Ag1

With the development requirement of world environmental protection,lead free solder wire will gradually replace the tin-lead solder wires. apply for the advanced technology, do research and development more and more special and very usefully lead free solder wire,low temperature solder wire,Tin Bismuth solder wire.
 Tin-Bismuth-silver(Sn64Bi35Ag1) solder wire, with a melting point of 179 degrees C, is ideal for soldering of temperature sensitive components. Supplied as a solid core (no inner flux core) lead free solder wire, this solder gives good wetting and solder flow. Packaged as a 1000g box this solder wire we recommend using with the PF670 flux gel to promote increased rapid wetting.

Low temperature eutectic Tin Bismuth alloy
Prevents thermal damage to heat sensitive devices
Low to non-toxic lead free solder
Available currently in a 0.5mm,0.6mm,0.8mm,1.2mm and 2.0mm diameter.
Packing：1kg/case

supply Sn64Bi35Ag1 tin bismuth silver solder wire,lead free low temperature solder wire,It has following feature.

Feature of Sn64Bi35Ag1 no flux core Bismuth solder wire

• The most popular lead-free bismuth solder alloys are BBI-W104 (58Bi 42Sn) which melts at 138°C and BBI-W105 (Sn64-Bi35Ag1) which melts at 179°C. The addition of the 1% Ag makes the alloy more malleable. Both alloys can be used for step soldering applications. After the initial joints are made with a standard SAC alloy (220°C) subsequent soldering operations can be done using the bismuth alloys.
• Sn64Bi35Ag Bi solder wire has joint properties similar to those of tin-lead solders, with superior fatigue and copper dissolution characteristics.
• Bismuth is the most diamagnetic and the least thermally conductive of all metals
• In addition to being non-toxic it does not oxidize as readily as lead does.

Feature of other solder wire is also available for Low temperature eutectic Tin Bismuth silver alloy:
Excellent scalability
High quality soldering wire on the market
Refined welding good fluidity, wetting, smoke spatter
Excellent First Pass Solder Joints. JIS Spread ≥ 80%.
Quick acting flue dissolves surface oxides for good wetting
Good solderability, insulation resistance, No spattering and Non-corrosive.
Widely used in electrical and electronics, solder parts like circuit board, electronics devices and others.

The more informations about Sn64Bi35Ag1 middle temperature metiong lead free solder wire,please feel freely contact 

an experienced and professional Chinese soldering manufacturer. We are specializing in research and development, production and selling of the soldering tin materials (solder wire, solder paste, solder bar/stick etc).

More than 10 years specialized in metal industry, accumulated a lot of talent and technology, created international marketing network, for now, we have cooperated with many of oversea enterprises of over 80 countries around the world.e.g.America,Israel,India,Germany,Russia,Poland,LTU,Switzerland,Korea,Romannia,Bulgaria,Colombia,France etc.
Specification of Sn/Bi/Ag low temperature solder wire:
Item：                 Low temperature solder wire
Specification:            BBI-W105(Sn64Bi35Ag1)
1. Purity and chemistry component

Specification	Sn64Bi35Ag1- no flux core solder wire
Appearance	Lucent,no dirt on surface
Weight	Net: 500g/case;1000g/case
Chemistry component
Elements    Specification(%)       Tested result(%WT) Sn                63.0~65.0                       64.0 Ag                0.8~1.2                           1.0 Al                 0.005                            0.0003 As                0.030                            0.0060 Sb                0.050                           0.0148 Bi                Remainder                    Remainder Cu                0.080                           0.0003 Fe                0.010                           0.0003 In                0.050                             0.0019 Ni                0.010                            0.0007 Pb                0.050                           0.0257 Cd                0.002                           0.0002 Au                0.050                           0.0010 Ag                0.050                           0.0002
a.       The above concentration of specification are in % weight. b.       Single value listed are the maximum allowable standard.Flux content(%): 0 Diameter of wire: 0.5mm,0.6mm,0.8mm,1.0mm,1.2mm and 2.0mm

Physical feature of Sn64Bi35Ag1 solid solder wire

Alloy component	Melting point℃	Working temperature℃	Gravity g/cm3	Rigidity  HB	Conduct heat M.S.K	Extend Mpa	Extend rate %	Conductivity  %
Sn64Bi35Ag1	179	100~210	8.5~8.7	11~12	68	45	70-100	18.0

The more informations about Sn64Bi35Ag1 middle temperature metiong lead free solder wire,please feel freely contact us.

Sn64Bi35Ag1 and other tin bismuth wire Application:

Advantages of Bismuth-based Alloys for Low Temperature Pb-free Soldering and Rework.
More and more requirment for middle and low temperature solder wire for moblie electronics,smart-home electronics..

The increased function of personal electronic devices, such as mobile phones and personal music devices, has driven the need for smaller and smaller active and passive components. This trend toward miniaturization, occurring at the same time as the conversion to RoHS-compliant lead-free assembly, has been a considerable challenge to the electronics assembly industry. The main reason for this is the higher reflow process temperatures required for Pb-free assembly. These higher temperatures can thermally damage the PCB and the components. In addition, the higher reflow temperatures can negatively affect the solder joint quality, especially when coupled with the smaller paste deposits required for these smaller components. If additional thermal processing is required, the risk increases even more.

Tin Bismuth Silver solder wire useage.

Packing of tin-bismuth-silver solder wire